Patents by Inventor Werner Simbuerger

Werner Simbuerger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8535983
    Abstract: In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: September 17, 2013
    Assignee: Infineon Technologies AG
    Inventors: Tze Yang Hin, Stefan Martens, Werner Simbuerger, Helmut Wietschorke, Horst Theuss, Beng Keh See, Ulrich Krumbein
  • Publication number: 20120309130
    Abstract: In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
    Type: Application
    Filed: June 2, 2011
    Publication date: December 6, 2012
    Applicant: Infineon Technologies AG
    Inventors: Tze Yang Hin, Stefan Martens, Werner Simbuerger, Helmut Wietschorke, Horst Theuss, Beng Keh See, Ulrich Krumbein
  • Patent number: 7863728
    Abstract: A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principal surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principal surface.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: January 4, 2011
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Patent number: 7692588
    Abstract: A semiconductor module (1) has components (6) for microwave engineering in a plastic casing (7). The semiconductor module (1) has a principal surface (8) with an upper side (9) of a plastic package molding compound (10) and at least one active upper side (11) of a semiconductor chip (12). Disposed on the principal surface (8) is a multilayered conductor track structure (13) which alternately comprises structured metal layers (14, 15) and structured insulation layers (16, 17), where at least one of the insulation layers (16, 17) and/or the plastic package molding compound (10) has at least one microwave insulation region.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: April 6, 2010
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Patent number: 7477105
    Abstract: A power amplifier comprises a control signal generator providing a first and a second signal, a first amplifier comprising a first transistor and a first cascode transistor for the amplification of the first signal, a second amplifier comprising a second transistor and a second cascode transistor for the amplification of the second signal, and an output coupler which couples an output of the first amplifier and an output of the second amplifier to an output terminal of the amplifier arrangement.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: January 13, 2009
    Assignee: Infineon Technologies AG
    Inventors: Werner Simbuerger, Winfried Bakalski, Ronald Thüringer, Marc Jan Georges Tiebout
  • Publication number: 20080105966
    Abstract: A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principle surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principle surface.
    Type: Application
    Filed: October 9, 2007
    Publication date: May 8, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Publication number: 20080061886
    Abstract: A power amplifier comprises a control signal generator providing a first and a second signal, a first amplifier comprising a first transistor and a first cascode transistor for the amplification of the first signal, a second amplifier comprising a second transistor and a second cascode transistor for the amplification of the second signal, and an output coupler which couples an output of the first amplifier and an output of the second amplifier to an output terminal of the amplifier arrangement.
    Type: Application
    Filed: September 8, 2006
    Publication date: March 13, 2008
    Inventors: Werner Simbuerger, Winfried Bakalski, Ronald Thuringer, Marc Jan Georges Tiebout
  • Patent number: 7301779
    Abstract: A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip.
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: November 27, 2007
    Assignee: Infineon Technologies AG
    Inventors: Wolfgang Hönlein, Hyang-Sook Klose, legal representative, Franz Kreupl, Werner Simbürger, Helmut Klose, deceased
  • Publication number: 20070026567
    Abstract: A semiconductor module (1) has components (6) for microwave engineering in a plastic casing (7). The semiconductor module (1) has a principal surface (8) with an upper side (9) of a plastic package molding compound (10) and at least one active upper side (11) of a semiconductor chip (12). Disposed on the principal surface (8) is a multilayered conductor track structure (13) which alternately comprises structured metal layers (14, 15) and structured insulation layers (16, 17), where at least one of the insulation layers (16, 17) and/or the plastic package molding compound (10) has at least one microwave insulation region.
    Type: Application
    Filed: June 1, 2006
    Publication date: February 1, 2007
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Patent number: 6580334
    Abstract: A monolithic integrated transformer, especially for high frequency application in for example GSM-mobile components wherein a coupling factor is attained by using slotted windings and components introduced therein from another winding. The transformer can be produced according to standard silicon bipolar technology with three metallic layers. The production of the transformer do not involve any additional expenditures.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: June 17, 2003
    Assignee: Infineon Technologies AG
    Inventors: Werner Simbürger, Hans-Dieter Wohlmuth