Patents by Inventor Wes Jeng

Wes Jeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slurry compositions for chemical mechanical polishing of copper and barrier films
    Publication number: 20050090104
    Abstract: CMP slurries comprising at least an abrasive, at least an organic phosphonate, at least an oxidizer, and water are disclosed. The slurries can optionally include corrosion inhibitors, surfactants, polymers, and bases. The concentrations of the ingredients in the slurries can be appropriately chosen to formulate copper CMP slurry and barrier CMP slurry. The copper CMP slurries are capable of polishing copper at high removal rate and having high selectivity to tantalum barrier. The barrier slurries deliver good planarity and have high hydrogen peroxide stability.
    Type: Application
    Filed: October 6, 2004
    Publication date: April 28, 2005
    Inventors: Kai Yang, Su-Man Tseng, Wes Jeng