Abstract: A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

Abstract: A process for fabricating sliders where the sliders are held in place during processing by a solid matrix material is described. A thin coating of a release-layer material is applied on the sliders before encapsulation in the matrix material. The release-layer material is polyvinyl alcohol and more preferably high molecular weight polyvinyl alcohol which is highly hydrolyzed. Use of the release-layer of the invention maintains the process resistance while providing the advantage of allowing easier removal of the matrix material after it is no longer needed. The release-layer can be applied to encapsulant materials including epoxies, acrylates, polyimides, silsesquioxanes and others. After the selected fabrication process such as the formation of air-bearing features an appropriate solvent is applied to soften the polyvinyl alcohol film and allow clean debonding of the sliders.

Abstract: A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render the encapsulant debondable. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

Abstract: A process for fabricating sliders where the sliders are held in place during processing by a solid matrix material is described. A thin coating of a release-layer material is applied on the sliders before encapsulation in the matrix material. The release-layer material is polyvinyl alcohol and more preferably high molecular weight polyvinyl alcohol which is highly hydrolyzed. Use of the release-layer of the invention maintains the process resistance while providing the advantage of allowing easier removal of the matrix material after it is no longer needed. The release-layer can be applied to encapsulant materials including epoxies, acrylates, polyimides, silsesquioxanes and others. After the selected fabrication process such as the formation of air-bearing features an appropriate solvent is applied to soften the polyvinyl alcohol film and allow clean debonding of the sliders.

Abstract: An actuator arm has a recess portion in its side surface which is positioned vertically during manufacture. A suspension having etched passages is placed next to the actuator arm such that the passages intersect the recess portion. A liquid adhesive is placed in the recess portion which act as an adhesive reservoir. The adhesive is then drawn into the passages and is cured such that the suspension is bonded to the actuator arm.

Abstract: A transducer suspension system has a transducer head, laminated member, and a load beam. The laminated member is comprised of a support layer, an electrically insulating layer, and an electrically conducting layer. The electrical lines are formed directly into the laminated member. A first end of the support layer has an aperture into which a tongue section protrudes. The transducer head is attached to the tongue section. A platform section is formed between the aperture and the end of the support layer. The electrical lines run to the transducer head along the platform section. The load beam is attached to the laminated member and provides rigid support. The load beam has an aperture located directly above the platform section and provides access to allow clamping of the electrical lines and the platform section during electrical attachment of the lines to the transducer head. Precise electrical attachment is achieved without unwanted bending of the delicate flexure section of the suspension.

Abstract: A transducer suspension system has a transducer head, laminated member, and a load beam. The laminated member is comprised of a support layer, an electrically insulating layer, and an electrically conducting layer. The electrical lines are formed directly into the laminated member. A first end of the support layer has an aperture into which a tongue section protrudes. The transducer head is attached to the tongue section. A platform section is formed between the aperture and the end of the support layer. The electrical lines run to the transducer head along the platform section. The load beam is attached to the laminated member and provides rigid support. The load beam has an aperture located directly above the platform section and provides access to allow clamping of the electrical lines and the platform section during electrical attach of the lines to the transducer head. Precise electrical attachment is achieved without unwanted bending of the delicate flexure section of the suspension.

Abstract: A combination of laser energy and ultrasonic energy is used for soldering an insulated wire to a pad located on a substrate. The combined laser energy and ultrasonic energy strips the insulation from the wire and solders the resulting bare wire to the pad. The method has particular use for soldering insulated wire to pads located on heat sensitive substrates or to pads located in close proximity to heat sensitive devices. A principal application is for soldering fine insulated wires for connecting a thin film magnetic head to a circuit carrier substrate.