Patents by Inventor Weston Roth
Weston Roth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120224331Abstract: A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.Type: ApplicationFiled: May 17, 2012Publication date: September 6, 2012Inventors: Weston Roth, Kevin Byrd, Damion Searls, James D. Jackson
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Publication number: 20090310320Abstract: A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.Type: ApplicationFiled: June 16, 2008Publication date: December 17, 2009Inventors: Weston Roth, Kevin Byrd, Damion Searls, James D. Jackson
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Patent number: 7495318Abstract: The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.Type: GrantFiled: May 2, 2005Date of Patent: February 24, 2009Assignee: Intel CorporationInventors: Weston Roth, Damion T. Searls, James D. Jackson
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Patent number: 7334325Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.Type: GrantFiled: November 16, 2004Date of Patent: February 26, 2008Assignee: Intel CorporationInventors: Weston Roth, Jayne L. Mershon, Xang Moua, Jason A. Mix
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Patent number: 7282647Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.Type: GrantFiled: December 23, 2002Date of Patent: October 16, 2007Assignee: Intel CorporationInventors: Weston Roth, Jayne L. Mershon, Xang Moua, Jason A. Mix
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Publication number: 20060024060Abstract: Numerous embodiments are described of an apparatus and method for line-of-sight, optical signal channel propagating in free-space for interconnectivity between semiconductor packages on a carrier substrate. In one embodiment, a first semiconductor package and a second semiconductor package are coupled to the carrier substrate. A free-space, line-of-sight optical signaling channel is formed between a first semiconductor package and a second semiconductor package. An optical emitter on the first semiconductor package propagates an optical signal to an optical detector on the second semiconductor package along the free-space, line-of-sight optical signaling channel.Type: ApplicationFiled: July 30, 2004Publication date: February 2, 2006Inventors: Weston Roth, James Jackson
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Publication number: 20060024002Abstract: A method includes providing a light pipe having a metallized end surface, and soldering the metallized end surface of the light pipe to a surface of a substrate. Other embodiments are described and claimed.Type: ApplicationFiled: August 2, 2004Publication date: February 2, 2006Inventors: Weston Roth, Damion Searls, Thomas Morgan, James Jackson
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Publication number: 20050195579Abstract: The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.Type: ApplicationFiled: May 2, 2005Publication date: September 8, 2005Applicant: Intel CorporationInventors: Weston Roth, Damion Searls, James Jackson
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Publication number: 20050138592Abstract: Various methods and apparatuses are described in which a printed circuit board has trace lines. Input/output pads on the printed circuit board may have approximately the same width dimension as a trace line connected to those input/output pads. A first group of vias in the printed circuit board may be aligned into a planar line with a set corridor spacing between adjacent of groups of vias also aligned into a planar line with the same axis to allow a routing space for lines in multiple layers of the printed circuit board to occur in the routing space established by the set corridor spacing.Type: ApplicationFiled: December 17, 2003Publication date: June 23, 2005Inventors: Thomas Morgan, James Jackson, Weston Roth
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Publication number: 20050134507Abstract: Apparatus and methods of fabricating antennae embedded within a ceramic material, such as a low temperature co-fired ceramic. Such ceramic material has a low coefficient of thermal expansion which reduces expansion and contraction stresses that can cause the signal transmission frequency to change and thereby affecting proper signal transmission.Type: ApplicationFiled: December 23, 2003Publication date: June 23, 2005Inventors: Terrance Dishongh, Weston Roth, Damion Searls, Tom Pearson
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Patent number: 6905979Abstract: The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.Type: GrantFiled: December 23, 2002Date of Patent: June 14, 2005Assignee: Intel CorporationInventors: Weston Roth, Damion T. Searls, James D. Jackson
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Patent number: 6884087Abstract: A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.Type: GrantFiled: September 24, 2003Date of Patent: April 26, 2005Assignee: Intel CorporationInventors: Damion Searls, Thomas Morgan, Weston Roth
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Publication number: 20050082088Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.Type: ApplicationFiled: November 16, 2004Publication date: April 21, 2005Inventors: Weston Roth, Jayne Mershon, Xang Moua, Jason Mix
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Publication number: 20050068788Abstract: A light pipe component designed with optically transparent material capable of transmitting and/or guiding optical wavelengths. The outer surface of each light pipe being coated with a metallic surface finish, with the exception of the ends of the light pipe. The light pipe component being placed on a PCB to form solder joints between the metallic surface finish of the light pipes and the PTH. The solder joints may now be used for transmitting both optical signals and electrical signals per each physical connection of the light pipes.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Inventors: Weston Roth, Damion Searls, Thomas Morgan, James Jackson
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Publication number: 20050064739Abstract: A socket including multiple contact areas socket contacts is provided. The multiple contact areas enable the placement of components, such as capacitors, resistors, diodes and the like between the socket and a substrate.Type: ApplicationFiled: September 24, 2003Publication date: March 24, 2005Inventors: Damion Searls, Thomas Morgan, Weston Roth
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Publication number: 20040118597Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.Type: ApplicationFiled: December 23, 2002Publication date: June 24, 2004Applicant: Intel CorporationInventors: Weston Roth, Jayne L. Mershon, Xang Moua, Jason A. Mix
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Publication number: 20040119147Abstract: The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.Type: ApplicationFiled: December 23, 2002Publication date: June 24, 2004Applicant: Intel CorporationInventors: Weston Roth, Damion T. Searls, James D. Jackson