Patents by Inventor Wilbert F. Janson, Jr.

Wilbert F. Janson, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an optoelectronic device package
    Patent number: 5216805
    Abstract: An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical element. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.
    Type: Grant
    Filed: May 22, 1992
    Date of Patent: June 8, 1993
    Assignee: Eastman Kodak Company
    Inventors: Gary A. Hallenbeck, Wilbert F. Janson, Jr., William B. Jones
  • Optoelectronic device component package
    Patent number: 5149958
    Abstract: An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical elements. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.
    Type: Grant
    Filed: December 12, 1990
    Date of Patent: September 22, 1992
    Assignee: Eastman Kodak Company
    Inventors: Gary A. Hallenbeck, Wilbert F. Janson, Jr., William B. Jones