Abstract: A decoupling capacitor is provided for a semiconductor device and may include a first low dielectric insulator layer and a low resistance conductor formed into at least two interdigitized patterns on the surface of the first low dielectric insulator in a single interconnect plane. A high dielectric constant material may be provided between the two patterns. A circuit for testing a plurality of these capacitors is also provided which includes a charge monitoring circuit, a coupling circuit and a control circuit.

Abstract: A decoupling capacitor is provided for a semiconductor device and may include a first low dielectric insulator layer and a low resistance conductor formed into at least two interdigitized patterns on the surface of the first low dielectric insulator in a single interconnect plane. A high dielectric constant material may be provided between the two patterns. A circuit for testing a plurality of these capacitors is also provided which includes a charge monitoring circuit, a coupling circuit and a control circuit.

Abstract: A decoupling capacitor is provided for a semiconductor device and may include a first low dielectric insulator layer and a low resistance conductor formed into at least two interdigitized patterns on the surface of the first low dielectric insulator in a single interconnect plane. A high dielectric constant material may be provided between the two patterns. A circuit for testing a plurality of these capacitors is also provided which includes a charge monitoring circuit, a coupling circuit and a control circuit.

Abstract: A method and system for providing communication between electronic devices that uses the phase of data transmitted between the devices to indicate logical one and zero values. The method and system has the added benefit of relieving the traditional limitations of voltage communication restraints between devices having differing core voltages (i.e. Differing generations).

Abstract: A way of dynamically modifying error recovery on a communications controller to operate at the lowest power mode allowed by current error rate conditions. When operating conditions are good and a small number of errors are detected, a low power error detection/correction mode is entered saving battery life. The low power error correction mechanism runs at a slower frequency and lower power than the high power mechanism and maintains the same data rate for the controller, thus saving power. Selecting the controller error (power) mode may be externally, such as by a person using a control dial on a cellular telephone when the voice data gets too noisy. Alternatively, the selection can be automatic, a critical error level detector internally making the selection.

Abstract: A method and structure for forming an emitter in a vertical bipolar transistor includes providing a substrate having a collector layer and a base layer over the collector layer, forming a patterning mask over the collector layer, and filling openings in the mask with emitter material in a damascene process. The CMOS/vertical bipolar structure has the collector, base regions, and emitter regions vertically disposed on one another, the collector region having a peak dopant concentration adjacent the inter-substrate isolation oxide.

Abstract: A method and structure for blowing a fuse including removing an insulator above a fuse link and etching the fuse link.

Abstract: A decoupling capacitor is provided for a semiconductor device and may include a first low dielectric insulator layer and a low resistance conductor formed into at least two interdigitized patterns on the surface of the first low dielectric insulator in a single interconnect plane. A high dielectric constant material may be provided between the two patterns. A circuit for testing a plurality of these capacitors is also provided which includes a charge monitoring circuit, a coupling circuit and a control circuit.

Abstract: A decoupling capacitor is provided for a semiconductor device and may include a first low dielectric insulator layer and a low resistance conductor formed into at least two interdigitized patterns on the surface of the first low dielectric insulator in a single interconnect plane. A high dielectric constant material may be provided between the two patterns. A circuit for testing a plurality of these capacitors is also provided which includes a charge monitoring circuit, a coupling circuit and a control circuit.

Abstract: Disclosed is a system and method for eliminating the unnecessary toggling of logic in a logic network. The method and system can be incorporated directly into logic synthesis software, or may be implemented manually. Provided is a mechanism for identifying critical nets and then inserting net latches at the critical nets wherein each net latch is controlled by an enable signal that also controls a related output latch. Each net latch is comprised of a circuit which can on command hold static the last logic level on a given logic node.

Abstract: An IC chip comprising, a nearby or remote source capable of particle emissions; circuitry formed in the IC chip that is adversely affected by impacts of particle emissions from said source; and a particle detector formed in the IC chip between the circuitry and source for detecting said particle emissions. In one embodiment of the present invention, the source comprises a solder ball that is formed on a surface of the IC chip, and the solder ball is capable of emitting alpha-particles. The particle emissions detector of the present invention is a reverse biased Schottky diode. The IC chip is formed by (a) providing an IC chip having at least one layer of particle sensitive circuitry formed therein; (b) forming another layer having at least one particle sensor region situated therein on a surface of said IC chip; and (c) optionally, forming at least one particle emission source over said another layer.

Abstract: The present invention provides a performance based system and method for dynamic allocation of a unified multiport cache. A multiport cache system is disclosed that allows multiple single-cycle look ups through a multiport tag and multiple single-cycle cache accesses from a multiport cache. Therefore, multiple processes, which could be processors, tasks, or threads can access the cache during any cycle. Moreover, the ways of the cache can be allocated to the different processes and then dynamically reallocated based on performance. Most preferably, a relational cache miss percentage is used to reallocate the ways, but other metrics may also be used.

Abstract: A significant and very effective decoupling capacitor and heat sink combination that, in a single structure provides both a heat sink and a decoupling capacitor in close proximity to the active circuit on the chip requiring either heat sinking or decoupling capacitance or both. This is achieved by forming on a semiconductor chip, having a buried oxide layer therein, an integrated high-performance decoupling capacitor that uses a metallic deposit greater than 30 microns thick formed on the back surface of the chip and electrically connected to the active chip circuit to result in a significant and very effective decoupling capacitor and heat sink in close proximity to the active circuit on the chip requiring such decoupling capacitance and heat sinking capabilities. The decoupling capacitance can use the substrate of the chip itself as one of the capacitive plates and a formed metallic deposit as the second capacitive plate which also serves as a heat sink for the active circuit formed in the chip.

Abstract: An IC chip comprising, a nearby or remote source capable of particle emissions; circuitry formed in the IC chip that is adversely affected by impacts of particle emissions from said source; and a particle detector formed in the IC chip between the circuitry and source for detecting said particle emissions. In one embodiment of the present invention, the source comprises a solder ball that is formed on a surface of the IC chip, and the solder ball is capable of emitting alpha-particles. The particle emissions detector of the present invention is a reverse biased Schottky diode. The IC chip is formed by (a) providing an IC chip having at least one layer of particle sensitive circuitry formed therein; (b) forming another layer having at least one particle sensor region situated therein on a surface of said IC chip; and (c) optionally, forming at least one particle emission source over said another layer.

Abstract: A method and apparatus are provided for managing cache allocation for a plurality of data types in a unified cache having dynamically allocable lines for first type data and for second type data. Cache allocation is managed by counting misses to first type data and misses to second type data in the unified cache, and by determining when a difference between a number of first type data misses and a number of second type data misses crosses a preselected threshold. A replacement algorithm of the unified cache then is adjusted in response to the detected crossing of the preselected threshold, the adjusting step including increasing a replacement priority of the first type data lines in the cache. The replacement algorithm preferably is an LRU algorithm wherein the adjusting step includes incrementing an age indication of the first type data lines.

Abstract: An IC chip comprising, a nearby or remote source capable of particle emissions; circuitry formed in the IC chip that is adversely affected by impacts of particle emissions from said source; and a particle detector formed in the IC chip between the circuitry and source for detecting said particle emissions. In one embodiment of the present invention, the source comprises a solder ball that is formed on a surface of the IC chip, and the solder ball is capable of emitting alpha-particles. The particle emissions detector of the present invention is a reverse biased Schottky diode. The IC chip is formed by (a) providing an IC chip having at least one layer of particle sensitive circuitry formed therein; (b) forming another layer having at least one particle sensor region situated therein on a surface of said IC chip; and (c) optionally, forming at least one particle emission source over said another layer.

Abstract: A current sensing circuit connected to a power supply terminal and having at least one input terminal and at least one output terminal includes at least one bipolar transistor having a base, emitter and collector, at least one current mirror amplifier connected to the power supply terminal, the current mirror amplifier having an input connected to the collector and having at least one output connected to the emitter, and a DC voltage source connected to the base.

Abstract: An automatic driver adjuster and methods using the same are provided that modify off-chip drivers based on load characteristics. The preferred embodiments are preferably automatic and require little or no human intervention. Preferred embodiments of the current invention analyze and determine the impedance of a node and adjust a number of output drivers in response to the impedance of the node, or analyze a resultant waveform of the node, caused by an input waveform, and adjust a number of output drivers in response to the resultant waveform of the node.

Abstract: A method and structure for a programmable circuit that includes a magnetic device having a reluctance which is alterable.

Abstract: A structure for an amplifier circuit which includes a pair of source-coupled differential transistors, each of source-coupled differential transistors having a body and a gate, and input transistors electrically connected to the source-coupled transistors. Also, the input transistors load the body and the gate of the source-coupled transistors with positive feedback signals. As a result, a differential gain is increased and a common mode gain is not increased. The output of the pair of source-coupled differential transistors is directed to second pair of transistors. The second pair of transistors generates mirrored voltages which track with input voltages. The second pair of transistors generates mirrored voltages translated by an offset voltage to values near ground, mirrored voltages which represent a voltage gain over an input voltage, and mirrored voltages which are largely differential and includes approximately no common mode input voltage.