Patents by Inventor Wilfried Mokwa
Wilfried Mokwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8932544Abstract: Disclosed are a method and a device for feeding and/or discharging fluids in microreactor arrays through one or several fluid ducts that extend into each individual microreactor and can be individually controlled and regulated, in order to control, regulate, influence, and/or verify processes. The fed or discharged amounts of fluid are introduced into or discharged from the volume of the reaction liquid during a continuous shaking process and are evenly mixed as a result of the shaking process. The continuous shaking process causes sufficient mass transfer and thorough mixing of the reaction partners or fluids while the reaction is not limited or restricted by the mass transfer conditions.Type: GrantFiled: June 28, 2007Date of Patent: January 13, 2015Assignee: m2p-labs GmbHInventors: Carsten Mueller, Ingo Klammer, Frank Kensy, Jochen Buechs, Mirko Hofmann, Andreas Buchenauer, Uwe Schnakenberg, Wilfried Mokwa
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Publication number: 20100211168Abstract: A visual prosthesis for an eye having a lens and a retina has first, second and third substrate parts. The first substrate part has a coil and is fixable in the lens. The second substrate part has stimulation electrodes and connection lines and is fixable to the retina. The third substrate part has a processing unit and connects the first and second substrate parts to each other, the processing unit being electrically connected to the coil and to the stimulation electrodes and being configured to convert a signal generated in the coil by an electromagnetic wave to a stimulation impulse and pass same on via the connection line to the stimulation electrodes. The first substrate part is foldable relative to the third substrate part.Type: ApplicationFiled: August 27, 2008Publication date: August 19, 2010Inventors: Michael Goertz, Hoc Khiem Trieu, Wilfried Mokwa
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Publication number: 20090320622Abstract: Disclosed are a method and a device for feeding and/or discharging fluids in microreactor arrays through one or several fluid ducts that extend into each individual microreactor and can be individually controlled and regulated, in order to control, regulate, influence, and/or verify processes. The fed or discharged amounts of fluid are introduced into or discharged from the volume of the reaction liquid during a continuous shaking process and are evenly mixed as a result of the shaking process. The continuous shaking process causes sufficient mass transfer and thorough mixing of the reaction partners or fluids while the reaction is not limited or restricted by the mass transfer conditions.Type: ApplicationFiled: June 28, 2007Publication date: December 31, 2009Inventors: Carsten Mueller, Ingo Klammer, Frank Kensy, Jochen Buechs, Mirko Hofmann, Andreas Buchenauer, Uwe Schnakenberg, Wilfried Mokwa
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Patent number: 6479890Abstract: A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For producing the microsystem, electronic components are first integrated in a semiconductor layer provided on a wafer. Subsequently, the semiconductor areas which are not required between the electronic components are etched away, whereupon the flexible foil is applied. A connection line is then applied to the flexible foil so as to interconnect the individual semiconductor elements. Finally, the semiconductor is etched away from the back so as to obtain the microsystem in the case of which the individual semiconductor elements are mechanically connected only by the flexible foil but no longer by the semiconductor substrate.Type: GrantFiled: August 31, 2000Date of Patent: November 12, 2002Assignee: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.Inventors: Hoc Khiem Trieu, Wilfried Mokwa, Lutz Ewe
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Patent number: 6460411Abstract: A flow sensor component consists of a diaphragm of monocrystalline silicon, the diaphragm having arranged therein filled slots which are filled with a thermally insulating material and which penetrate the diaphragm from a first main surface to a second main surface thereof. The filled slots defining at least one heating area of the diaphragm provided with at least one heating element and at least one detection area of the diaphragm provided with at least one temperature detection element, the filled slots thermally insulating the heating area and the detection area from one another and surrounding the heating area and the detection area completely.Type: GrantFiled: August 3, 1999Date of Patent: October 8, 2002Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventors: Ralf Kersjes, Wilfried Mokwa, Günter Zimmer, Holger Vogt
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Patent number: 6443893Abstract: A device for measuring intraocular pressure includes a remote measuring device that can be implanted in the eye and that contains a pressure sensor, a device that can convert the sensor signals into information that can be transmitted without wires, and a transmitter. The device also includes a receiving device located outside the eye which receives the information transmitted by the transmitter and which is connected to an evaluation device in which the received information is converted into data on the intraocular pressure for recording.Type: GrantFiled: April 24, 2000Date of Patent: September 3, 2002Assignees: Acritec GmbH, Mesotec Gesellschaft für Medizinische Sensortechnik mbHInventors: Uwe Schnakenberg, Wilfried Mokwa, Christine Kreiner, Horst Richter
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Patent number: 5677560Abstract: A micromechanical component having a carrier and a deformable element of a flat design disposed parallel to a surface of the carrier, with the deformable element being provided with a mechano-electric signal converter. The carrier and the deformable element are fabricated in one piece out of a semiconductor substrate and are electrically insulated from one another, with the insulation being obtained by a buried layer produced by ion implantation thereby providing a micromechanical component which is suitable for joint integration with electric circuits in CMOS technology.Type: GrantFiled: April 27, 1995Date of Patent: October 14, 1997Assignee: Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung e.V.Inventors: Gunther Zimmer, Wilfried Mokwa
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Patent number: 5583296Abstract: A pressure sensor comprises a substrate and a layer defining together with said substrate a pressure sensor cavity, said layer including a diaphragmlike area which is adapted to be acted upon by an external pressure. A micro-miniaturizable pressure sensor of the above-mentioned type, which is used for differential pressure measurement or for relative pressure measurement, is provided on the basis of the features that said cavity is followed by a channel which extends along the surface of said substrate, said channel comprising a layered structure including also the layer which also defines the diaphragmlike area of the pressure sensor, the ratio of the width of the channel to the thickness of the layered structure above the channel being smaller than the ratio of the smallest extension of the diaphragmlike area in the diaphragm plane to the thickness of the diaphragmlike area.Type: GrantFiled: May 17, 1995Date of Patent: December 10, 1996Assignee: Fraunhofer-Gesellschaft zur Forderung Der Angewandten Forschung E. V.Inventors: Wilfried Mokwa, Michael Kandler, Jorg Amelung
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Patent number: 5431057Abstract: A process for manufacturing an integratable capacitative pressure sensor includes the following steps, starting from a semiconductor substrate (1): application of a guard film (2), precipitation of a polycrystalline semiconductor film (4), doping the polycrystalline semiconductor film (4) and removal of the guard film (2) by etching; then insulating the semiconductor zone (7) from the semiconductor substrate (1), and applying an insulator film (8) on the insulated semiconductor zone (7). The pressure sensor product, which is compatible with CMOS circuits and has increased sensor accuracy, includes a semiconductor zone (7) insulated from the semiconductor substrate (1) and an insulator film (8) applied on the insulated semiconductor zone (7), the polycrystalline semiconductor film (4) being located on the insulator film (8) above the insulated semiconductor zone (7).Type: GrantFiled: February 18, 1994Date of Patent: July 11, 1995Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung e.V.Inventors: Gunther Zimmer, Jorg Eichholz, Wilfried Mokwa, Michael Kandler, Yiannakis Manoli
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Patent number: 5321989Abstract: A process for manufacturing an integratable capacitative pressure sensor includes the following steps, starting from a semiconductor substrate (1): application of a guard film (2), precipitation of a polycrystalline semiconductor film (4), doping the polycrystalline semiconductor film (4) and removal of the guard film (2) by etching; then insulating the semiconductor zone (7) from the semiconductor substrate (1), and applying an insulator film (8) on the insulated semiconductor zone (7). The pressure sensor product, which is compatible with CMOS circuits and has increased sensor accuracy, includes a semiconductor zone (7) insulated from the semiconductor substrate (1) and an insulator film (8) applied on the insulated semiconductor zone (7), the polycrystalline semiconductor film (4) being located on the insulator film (8) above the insulated semiconductor zone (7).Type: GrantFiled: February 26, 1993Date of Patent: June 21, 1994Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung e.V.Inventors: Gunther Zimmer, Jorg Eichholz, Wilfried Mokwa, Michael Kandler, Yiannakis Manoli