Abstract: A printed circuit module comprises a printed circuitboard equipped with integrated modules, a connector part and a contact pressure part exerting a pressure on a printed circuitboard surface, for example, a cooling device. In order to prevent warping or bending of the printed circuitboard due to the contact pressure component or due to plugging and unplugging operations, and from causing line breaks or the like, a counterpressure on the printed circuitboard is generated and a flexible connection is established between the connector part and the printed circuitboard. To this end, contacting elements of the connector part are uniformly, aerially distributed over the printed circuitboard.

Abstract: The invention relates to a method and apparatus for heat exchange, especially for cooling at solid surfaces. At the solid surfaces, a locally uniform convective heat exchange is achieved. According to the invention, a sink flow is superimposed on a circular flow of a fluid in a flow chamber (1) at a surface of a heat-conducting solid wall (9) by means of a distributor, forming a vortex sink flow. The heat exchange surface of the component (9) to be cooled is at the same time the base plate (8) of a flow chamber (1).