Abstract: A light emitting device comprising a substrate (6) having an electrically conducting circuit layer (8), a LED package (7) surface mounted on the substrate (6) and electrically connected to the circuit layer (8), and a heat sink element, surface mounted on the substrate (6) separately from the LED package (7), the heat sink element having a body (2) of a heat conductive material surrounding the LED package (7), the body being thermally connected to the circuit layer (8), and being adapted to provide heat dissipation from the circuit layer (8) to a surrounding environment, wherein a surface (3) of the heat sink element facing the LED package is adapted to form part of a beam shaping optics for shaping light emitted from the LED package. Since the heat sink body is in thermal contact with the circuit layer, the heat resistance from the LED package to the heat sink body via the circuit layer is minimized.

Abstract: A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).

Abstract: A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).

Abstract: A light emitting device comprising a substrate (6) having an electrically conducting circuit layer (8), a LED package (7) surface mounted on the substrate (6) and electrically connected to the circuit layer (8), and a heat sink element, surface mounted on the substrate (6) separately from the LED package (7), the heat sink element having a body (2) of a heat conductive material surrounding the LED package (7), the body being thermally connected to the circuit layer (8), and being adapted to provide heat dissipation from the circuit layer (8) to a surrounding environment, wherein a surface (3) of the heat sink element facing the LED package is adapted to form part of a beam shaping optics for shaping light emitted from the LED package. Since the heat sink body is in thermal contact with the circuit layer, the heat resistance from the LED package to the heat sink body via the circuit layer is minimized.

Abstract: A printed circuit board (10) including a layered transformer (1) has a stack of layers of a first magnetic layer (2), a first transformer coil (4), an insulating body (7), a second transformer coil (5) and a second magnetic layer (3), wherein each of the transformer coils (4, 5) is embodied as a two-dimensional pattern of conductive tracks. The insulating body may comprise one of more channels (8, 18, 28) containing a magnetic material. Instead of one printed circuit board (10), the transformer (1) may be embodied in two printed circuit boards (60) as well, each comprising a magnetic layer (2) and a transformer coil (4). Said printed circuit boards may be included in a charger device (71) and a user device (72).

Abstract: A printed circuit board (10) including a layered transformer (1) has a stack of layers of a first magnetic layer (2), a first transformer coil (4), an insulating body (7), a second transformer coil (5) and a second magnetic layer (3), wherein each of the transformer coils (4,5) is embodied as a two-dimensional pattern of conductive tracks. The insulating body may comprise one of more channels (8,18,28) containing a magnetic material. Instead of one printed circuit board (10), the transformer (1) may be embodied in two printed circuit boards (60) as well, each comprising a magnetic layer (2) and a transformer coil (4). Said printed circuit boards may be included in a charger device (71) and a user device (72).