Patents by Inventor Willem Heuvelman

Willem Heuvelman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070004096
    Abstract: A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An electrical connection is provided between the base layers and the one or more metallization layers formed above the micromechanical element.
    Type: Application
    Filed: June 26, 2006
    Publication date: January 4, 2007
    Inventor: Willem Heuvelman