Abstract: An inkjet device for controlled positioning of a droplet of a substance onto a substrate includes a print head having a nozzle configured to eject the droplet. A camera is configured to detect and generate images of the droplet after ejection of the droplet from the nozzle. If the droplet volume, velocity, flight path, viscosity or surface tension start to deviate from preset values, a computer is configured to correct for this in a closed loop manner. If the droplet fails to eject, the computer is configured to stop the inkjet device and an operator can maintain the print head. The computer is configured to determine viscosity and surface tension of the droplet from characteristics of the droplet identified from the droplet images, and the computer is configured to control the positioning of the droplet onto the substrate during the printing process based on the determined viscosity and surface tension.

Abstract: The present invention relates to an apparatus for manufacturing an integrated circuit (10) having a thick film metal layer (14). A layer of metal paste (14) is applied via an application means (24) onto a heat-conducting substrate (12). The metal paste (14) includes metal particles of a predetermined size. An RF generator (16) selectively inductively couples RF energy (18) into the metal paste (14). The predetermined size of the metal particles of the metal paste (14) corresponds to a coupling frequency of the RF energy (18), for heating the metal particles. In this way the metal particles of the metal paste (14) are heated with only a small fraction of the power of conventional processes, and without the need to pre-sinter the metal paste (14).

Abstract: An apparatus for manufacturing an integrated circuit having a thick film metal layer includes an applicator configured to selectively apply a paste on a heat-conducting substrate. The paste includes particles of a first metal constituent of particles having sizes substantially within a narrow predetermined range about a predetermined size. The apparatus further includes a radio frequency (RF) generator to selectively inductively coupling RF energy into the paste. The first metal particles of the predetermined size are inductively couplable with the RF energy, and the frequency of the RF energy corresponds to a coupling frequency of the first metal particles of the predetermined size so that the inductive heating of the first metal particles is substantially maximized.

Abstract: The present invention relates to an apparatus for manufacturing an integrated circuit (10) having a thick film metal layer (14). A layer of metal paste (14) is applied via an application means (24) onto a heat-conducting substrate (12). The metal paste (14) includes metal particles of a predetermined size. An RF generator (16) selectively inductively couples RF energy (18) into the metal paste (14). The predetermined size of the metal particles of the metal paste (14) corresponds to a coupling frequency of the RF energy (18), for heating the metal particles. In this way the metal particles of the metal paste (14) are heated with only a small fraction of the power of conventional processes, and without the need to pre-sinter the metal paste (14).

Abstract: An apparatus for manufacturing an integrated circuit having a thick film metal layer includes an applicator for applying a layer of metal paste onto a heat-conducting substrate. The metal paste includes metal particles of a predetermined size. An RF generator selectively inductively couples RF energy into the metal paste. The predetermined size of the metal particles of the metal paste corresponds to a coupling frequency of the RF energy for heating the metal particles. In this way, the metal particles of the metal paste are heated with only a small fraction of the power of conventional processes, and without the need to pre-sinter the metal paste.

Abstract: The present invention relates to an apparatus for manufacturing an integrated circuit (10) having a thick film metal layer (14). A layer of metal paste (14) is applied via an application means (24) onto a heat-conducting substrate (12). The metal paste (14) includes metal particles of a predetermined size. An RF generator (16) selectively inductively couples RF energy (18) into the metal paste (14). The predetermined size of the metal particles of the metal paste (14) corresponds to a coupling frequency of the RF energy (18), for heating the metal particles. In this way the metal particles of the metal paste (14) are heated with only a small fraction of the power of conventional processes, and without the need to pre-sinter the metal paste (14).

Abstract: The invention provides a device for the controlled positioning of droplets of a substance onto a substrate, the device comprising at least a print head comprising a nozzle provided to eject the droplet, the inkjet device further comprising a control camera arranged such that after ejection of the droplet out of the nozzle, the droplet is detected by the control camera. In case either the droplet volume or velocity or flight path or viscosity or surface tension start to deviate from preset values, the software can correct for this in a closed loop manner. If the droplet is not ejected at all, the control software stops the printer and an operator can maintain the print head.