Patents by Inventor William A. Donson

William A. Donson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5242713
    Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: September 7, 1993
    Assignee: International Business Machines Corporation
    Inventors: Alfred Viehbeck, Stephen L. Buchwalter, William A. Donson, John J. Glenning, Martin J. Goldberg, Kurt R. Grebe, Caroline A. Kovac, Linda C. Matthew, Walter P. Pawlowski, Mark J. Schadt, Michael R. Scheuermann, Stephen L. Tisdale
  • Patent number: 4690833
    Abstract: A process for providing circuit lines on a substrate having a non-planar surface is provided. The process includes applying a layer of photoresist material to the substrate, selectively screen printing on non-planar areas of the substrate a screen-printable coating, photoprocessing the layer of photoresist material, and providing electrical conductive pattern on the substrate.
    Type: Grant
    Filed: March 28, 1986
    Date of Patent: September 1, 1987
    Assignee: International Business Machines Corporation
    Inventors: William A. Donson, James V. Ellerson, Richard B. Hammer, William Lafer, Keith A. Snyder