Abstract: A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of +/?5° C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.

Abstract: Systems, methods, and apparatus are provided for including a chip embedded in components of electronic device manufacturing systems adapted to sense, store, and/or update at least one of identification, operational-related and process-related information associated with the components. In other aspects of the invention, a processing chamber component having an embedded chip with storage capacity is adapted to record at least one of identification, operational-related and process-related information associated with the component; and to communicate the information from the chip to enable determination of an operational state of the component. Numerous other aspects are disclosed.

Abstract: The present invention generally comprises a physical vapor deposition (PVD) system having separate susceptor, cathode, and lid sections in which each section is on a rail that elevates the sections off the ground. The cathode section may comprise a plurality of rotatable cathodes that lie in a plane such that the axis of rotation for the rotary cathodes is perpendicular to the ground. The lid section and the cathode section may be moved on the rails to open the cathode section for servicing. Of the plurality of rotatable cathodes, the cathodes corresponding to the center of the substrate upon which material will be deposited are spaced a greater distance from the substrate than rotatable cathodes corresponding to the edge of the substrate.