Abstract: A heat dissipation device for removing heat from an electronic device package includes a retaining clip having a central member and a first pair of legs depending downwardly therefrom. The retaining clip has a bore with female threading therein. Free ends of the legs are secured to the semiconductor device package. A fan module, having a threaded base portion with a lower edge; is threadably received in the bore of the retaining clip so that the lower edge of the fan module remains in communication with the upper surface of the semiconductor package. As a result, the fan module is secured to the semiconductor device for removing heat therefrom.

Abstract: A reverse mount heat dissipating device, for removing heat from an electronic device package, includes a circuit board with a bore therethrough. A semiconductor package is affixed to the top surface of the circuit board via a number of electrical contacts. The semiconductor package is positioned over the bore of the circuit board. A retaining collar is positioned in the bore of the circuit board. The retaining collar is secured in the bore in the circuit board by a circumferential groove and flanges. The retaining collar also includes a female threaded collar bore therethrough. A heat dissipating member, with a male threaded shank portion and a substantially flat top surface, is threadably received in the female threaded collar bore so that the flat top surface of the heat dissipating member is in flush thermal communication with the bottom surface of said semiconductor package.

Abstract: A heat sink assembly for removing heat from multiple semiconductor device packages is disclosed. The heat sink assembly includes a circuit board where a first semiconductor device package is installed on the circuit board. A second semiconductor device package is installed on the circuit board. A support plate is positioned over the upper surface of said first semiconductor device and over the upper surface of the second semiconductor device. The support plate includes two threaded bores corresponding to the positioning and layout of the first and second semiconductor devices. The support plate is, preferably, secured relative to the first semiconductor device and said second semiconductor device by a clip on one side of the support plate and a pair of threaded fasteners on the opposing end.

Abstract: A heat sink assembly, having a number of mounting holes therethrough, is installed on a heat generating surface of an electronic component for removing heat therefrom. A retaining clip has a central member and a number of legs which depending downwardly from the central member with ends of the legs not connected to the central member being free ends. Retention members are provided on each of the free ends of the legs to prevent the legs from being removed from their respective mounting holes. A heat dissipating member, having a threaded base portion is threadably received in a bore in the central member so that the flat bottom surface of the heat dissipating member is in flush thermal communication with the electronic component while the legs are secured within their respective holes in the electronic component.

Abstract: A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured to the ceramic portion of the semiconductor package via a number of fasteners. A heat dissipating member, having male-threaded base, is threadably inserted into the female-threaded bore to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member is independently adjustable relative to the attachment pressure of the top member onto the ceramic portion of the semiconductor package. As a result, the multiple pressure requirements of the semiconductor package can be accommodated in a single heat dissipating device.

Abstract: A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured, without the use of tools, to the ceramic portion of the semiconductor package by a pair of upwardly standing legs with inwardly turned flanges where the flanges engage the marginal opposing portions of the top member. A heat dissipating member, having male-threaded base, is threadably inserted into the female-threaded bore to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member is independently adjustable, by hand, relative to the preset pressure of the top member onto the ceramic portion of the semiconductor package.

Abstract: A heat sink assembly with an adjustable and customizable mounting clip is provided. The length of the mounting clip can be precisely adjusted to accommodate integrated circuit device sockets of varying lengths. Unused legs of the mounting clip can be completely removed to accommodate neighboring circuit board components. With the mounting clip adjusted and legs selected, a heat sink member is threaded through the top planar member of the mounting clip into flush thermal communication with the top surface of an integrated circuit device to effectuate heat dissipation therefrom.

Abstract: A heat sink assembly with an adjustable and customizable mounting clip is provided. The legs of the mounting clip are adjustable to accommodate heat sink members of different sizes and shapes. The overall height of the mounting clip is adjustable by selecting a particular radial flange for mounting to a flange seat on a universal top member. With the leg length selected, unwanted portions of the legs may be snapped off and discarded to leave a customized, low-profile heat sink assembly.

Abstract: A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. Alternate embodiments show the heat sink which has a snap on flange to attach the heat sink to the adaptor and the adaptor extending down to engage with the socket in which the microprocessor is installed.

Abstract: A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. An alternate embodiment shows the heat sink which has a snap on flange to attach the heat sink to the adaptor.