Abstract: This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-tin catalyst on a resin substrate, and then treating said resin substrate having the catalyst deposited thereon with a formaldehyde-free electroless copper plating solution that contains copper ions and a reducing agent, wherein the need for an accelerating treatment of a catalyst after said catalyst depositing treatment is obviated. The productivity of a copper-resin composite material is dramatically enhanced by the process of the present invention, because a copper thin layer can be formed on the resin substrate in a short time, even if an accelerating treatment for a catalyst is not performed in a separate process.

Abstract: A method for preparing nickel hypophosphite by contacting a nickel anode with a solution of hypophosphite anions and applying a current through the anode to a counter-electrode in contact with the solution to anodically dissolve the nickel of the anode into the hypophosphite solution, thereby forming a nickel hypophosphite solution. A one-compartment electrolysis cell and a three-or-more-compartment electrodialysis cell embodying the method of the invention are described.

Abstract: Methods for preparing hypophosphorous acid are disclosed comprising contacting an insoluble anode with an aqueous solution of hypophosphite anions and applying a current through the insoluble anode to a cathode in electrical contact with the aqueous solution to generate H+ ions in the aqueous solution thereby forming a hypophosphorous acid solution.

Abstract: The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.

Abstract: The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.

Abstract: The present invention relates to a method for promoting and improving the adhesion of an electroless metal deposit to the metal surface of a composite substrate having both a conductive metal area and an activated non-conductive surface. The process comprises treating such a substrate, subsequent to catalyzation or activation of the substrate, and prior to electroless metal deposition thereon, with an adhesion promotor compound or mixture of compounds.