Patents by Inventor William Burghout

William Burghout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die back layer separation method
    Patent number: 9337098
    Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer having a backmetal layer by placing the semiconductor wafer onto a carrier tape with the backmetal layer adjacent the carrier tape, forming singulation lines through the semiconductor wafer to expose the backmetal layer within the singulation lines, and separating portions of the backmetal layer using a fluid.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: May 10, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Michael Seddon, William Burghout
  • Method of forming a leaded molded array package
    Publication number: 20070111393
    Abstract: In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals between conductive leads within the lead frame assembly and the lead cavities, and encapsulating the lead frame assembly to form a molded array assembly. The molded array assembly is then separated into individual leaded molded packages.
    Type: Application
    Filed: October 28, 2005
    Publication date: May 17, 2007
    Inventors: William Burghout, Francis Carney, Joseph Fauty, James Letterman, Jay Yoder