Patents by Inventor William C. Bamford

William C. Bamford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6851467
    Abstract: A heat sink assembly includes a heat exchanging section formed by a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end edges. The folded sheet is formed into a generally cylindrical configuration whereby the troughs form an inner segmented cylinder and the ridges form an outer segmented cylinder generally concentric with the inner cylinder. The heat sink assembly may include a heat conductive rod dimensioned to engage the troughs of the thermally conductive sheet. The ridges of the thermally conductive sheet may also contain apertures to allow air to fully circulate through the fins. The heat sink assembly may also include a fan and a thermally conductive base plate.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: February 8, 2005
    Assignee: Molex Incorporated
    Inventors: William C. Bamford, Blaine C. Wotring, Gregory T. Wyler
  • Publication number: 20040200601
    Abstract: A heat sink assembly includes a heat exchanging section formed by a thermally conductive sheet folded into alternating ridges and troughs defining generally parallel spaced fins having opposite end edges. The folded sheet is formed into a generally cylindrical configuration whereby the troughs form an inner-segmented cylinder and the ridges form an outer-segmented cylinder generally concentric with the inner cylinder. The heat sink assembly may include a heat conductive rod dimensioned to engage the troughs of the thermally conductive sheet. The ridges of the thermally conductive sheet may also contain apertures to allow air to fully circulate through the fins. The heat sink assembly may also include a fan and a thermally conductive base plate.
    Type: Application
    Filed: April 29, 2004
    Publication date: October 14, 2004
    Inventors: William C. Bamford, Blaine C. Wotring, Gregory T. Wyler
  • Patent number: 4657320
    Abstract: An electrical connector assembly for first and second pivotally mounted circuit members includes a dielectric housing portion for each member, each portion having a plurality of terminal receiving cavities formed therein, with first and second sets of terminals mounted therein. The housing portions are joined together for pivoting about an axis of rotation. Each terminal of each housing portion has a mating contact surface centrally located with respect to the axis of rotation. A compressive bias force is applied between mating terminal pairs which extends along the axis of rotation.
    Type: Grant
    Filed: August 13, 1984
    Date of Patent: April 14, 1987
    Assignee: Molex Incorporated
    Inventors: William C. Bamford, Yasuhiro Ichijo
  • Patent number: 4417777
    Abstract: An integrated circuit carrier assembly includes a carrier and a socket nestable on one side of the carrier, the other side of carrier receiving an integrated circuit device. The carrier includes a set of guides one aligned with each lead of the integrated circuit device. Each guide includes a passage which allows a lead to telescope through the carrier into the socket, and a set of tapered surfaces that guide the lead into the passage. The socket includes a terminal that connects each lead of the integrated circuit device to one of a plurality of more durable contact prongs which may then be inserted into the appropriate receptacles of a printed circuit board or the like.
    Type: Grant
    Filed: October 13, 1981
    Date of Patent: November 29, 1983
    Assignee: Molex Incorporated
    Inventor: William C. Bamford