Patents by Inventor William C. Downing

William C. Downing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad for a semiconductor substrate
    Patent number: 6117000
    Abstract: A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pad includes a bottom surface that is mechanically buffed to improve the adhesion of an adhesive to the pad bottom surface.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: September 12, 2000
    Assignee: Cabot Corporation
    Inventors: Sriram P. Anjur, William C. Downing