Abstract: The present invention is directed to an ink receptive film and methods of using the ink receptive film. The ink receptive film is generally suitable for etching patterns into substrates, and typically includes a photosensitive laminate structure containing at least an ink receptive, radiation transmissive layer; and at least one photosensitive resist layer.

Abstract: The present invention is directed to metal articles and methods of making the metal articles. The metal articles comprise a compression-formed particulate metal object, wherein a portion of the compression-formed particulate metal object has been selectively removed by an etching process from at least one surface of the object. The etching process is frequently performed using abrasive etching.

Abstract: The present invention is directed to an ink receptive film and methods of using the ink receptive film. The ink receptive film is generally suitable for etching patterns into substrates, and typically includes a photosensitive laminate structure containing at least an ink receptive, radiation transmissive layer; and at least one photosensitive resist layer.

Abstract: The present invention is directed to devices and methods for exposing photoreactive compositions. Specifically, the invention is directed to devices and methods for exposing photoreactive compositions with light from light emitting diodes (LEDs). In certain embodiments the device includes an apparatus for retaining a photosensitive substrate containing a photoreactive composition, a light emitting diode array containing a plurality of light emitting diodes, and a control mechanism for regulating the intensity and distribution of light emitted from the light emitting diode array. In such implementations the light emitting diodes are configured and arranged for controlled exposure of the photoreactive composition.