Abstract: Example embodiments relate generally to surgical systems. The system may include a first arm assembly having a first arm assembly body. The system may also include a distal elbow joint assembly secured to a proximal end of the first arm assembly. The distal elbow joint assembly may be configurable to provide the first arm assembly with a first degree of freedom relative to a first axis. The system may also include a proximal elbow joint assembly secured to the distal elbow joint assembly. The proximal elbow joint assembly may be configurable to provide the first arm assembly with a second degree of freedom relative to a second axis. The second axis may be different from the first axis. The first degree of freedom may be different from the second degree of freedom.

Abstract: Example surgical systems include end-effector assembly, arm assembly, and elbow joint assembly. Arm assembly includes proximal and distal ends. Elbow joint assembly secures proximal end of arm assembly to distal end of second arm assembly. Elbow joint assembly includes first and second elbow joint portions. First elbow joint portion includes first end section secured to proximal end of arm assembly, second end section, and first joint joining first and second end sections of first elbow joint portion. Second elbow joint portion includes first end section secured to second end section of first elbow joint portion, second end section secured to distal end of second arm assembly, and second joint joining first and second end sections of second elbow joint portion. First end section of first and second elbow joint portion are pivotable relative to first and second axes, respectively, formed by center line drawn through first and second joints, respectively.

Abstract: Example surgical systems include end-effector assembly, arm assembly, and elbow joint assembly. Arm assembly includes proximal and distal ends. Elbow joint assembly secures proximal end of arm assembly to distal end of second arm assembly. Elbow joint assembly includes first and second elbow joint portions. First elbow joint portion includes first end section secured to proximal end of arm assembly, second end section, and first joint joining first and second end sections of first elbow joint portion. Second elbow joint portion includes first end section secured to second end section of first elbow joint portion, second end section secured to distal end of second arm assembly, and second joint joining first and second end sections of second elbow joint portion. First end section of first and second elbow joint portion are pivotable relative to first and second axes, respectively, formed by center line drawn through first and second joints, respectively.

Abstract: Example embodiments relate to surgical systems having end-effector assembly, first and second arm assemblies, and elbow joint assembly. End-effector assembly includes instrument assembly and wrist assembly. Instrument assembly includes a first instrument. First arm assembly includes a body, first and second instrument drive assemblies, wrist drive assembly, and first arm drive assembly. First instrument drive assembly is configurable to move first instrument relative to first axis. Wrist drive assembly is configurable to move instrument assembly relative second axis. First arm drive assembly is configurable to rotate end-effector assembly relative to third axis. Elbow joint assembly includes elbow pitch joint portion configurable to be driven to move first arm assembly relative to fourth axis. Elbow joint assembly also includes elbow sway joint portion configurable to be driven to move first arm assembly relative to fifth axis.

Abstract: Example embodiments relate to surgical systems having end-effector assembly, first and second arm assemblies, and elbow joint assembly. End-effector assembly includes instrument assembly and wrist assembly. Instrument assembly includes a first instrument. First arm assembly includes a body, first and second instrument drive assemblies, wrist drive assembly, and first arm drive assembly. First instrument drive assembly is configurable to move first instrument relative to first axis. Wrist drive assembly is configurable to move instrument assembly relative second axis. First arm drive assembly is configurable to rotate end-effector assembly relative to third axis. Elbow joint assembly includes elbow pitch joint portion configurable to be driven to move first arm assembly relative to fourth axis. Elbow joint assembly also includes elbow sway joint portion configurable to be driven to move first arm assembly relative to fifth axis.

Abstract: A computer program product is embodied on a non-transitory computer readable medium. The computer program product comprises computer code to display a plurality of first indicia presented in a list, where each first indicia indicates a software product, and computer code to display a second indicia associated with a highlighted one of the first indicia. The second indicia comprises information about the software product indicated by the highlighted first indicia. The computer program product additionally comprises computer code to display a third indicia associated with the highlighted first indicia and indicate the availability of a software update for the software product indicated by the highlighted first indicia, and computer code to display a fourth indicia associated with the highlighted first indicia. The fourth indicia facilitates the retrieval of the software update.

Abstract: A optical control sensor system includes a driver controlling an operation of a light source coupled to an end of an optical fiber, an orthogonal signal generator, generating a set of different orthogonal signals controlling the driver, a terminal sensor coupled to another end of the optical fiber selecting a predetermined set of input orthogonal signals for converting them into component combinations, constituting output signals, and directing the output signals back to the optical fiber, a device coupled to the light sources and to the first end of the optical fiber for extracting output signals that have passed through a return path in the optical fiber, a detector converting optical output signals into electrical signals, and a selector and a decoder connected to the orthogonal signal generator indicating a current state of the optical control sensor system based on an analysis of the selected combinations of components in the output signals.

Abstract: The present invention provides a touch module and a display device using the same. The touch module comprises a plastic substrate plate, a first line pattern, an optical substrate, and a second line patter. The first line pattern is formed on the plastic substrate plate. The optical substrate is adjacent to the plastic substrate plate and covers on the first line pattern. The second line pattern is adjacent to the optical substrate. The first and the second line patterns are not connected to each other. The invention replaces glass with the plastic substrate. Comparing to the prior art, the invention reduces weight and cost and increases the durability.

Abstract: An integrated circuit structure includes a semiconductor chip having a die side and a non-die side, the die side having one or more trenches formed therein. The integrated circuit structure further includes at least one die bonded onto the die side of the semiconductor chip. The integrated circuit structure further includes a protecting material encapsulating the at least one die and substantially filling the one or more trenches.

Abstract: A computer program product is embodied on a non-transitory computer readable medium. The computer program product comprises computer code to display a plurality of first indicia presented in a list, where each first indicia indicates a software product, and computer code to display a second indicia associated with a highlighted one of the first indicia. The second indicia comprises information about the software product indicated by the highlighted first indicia. The computer program product additionally comprises computer code to display a third indicia associated with the highlighted first indicia and indicate the availability of a software update for the software product indicated by the highlighted first indicia, and computer code to display a fourth indicia associated with the highlighted first indicia. The fourth indicia facilitates the retrieval of the software update.

Abstract: An integrated circuit structure includes a semiconductor chip having a die side and a non-die side, the die side having one or more trenches formed therein. The integrated circuit structure further includes at least one die bonded onto the die side of the semiconductor chip. The integrated circuit structure further includes a protecting material encapsulating the at least one die and substantially filling the one or more trenches.

Abstract: A computer program product is embodied on a non-transitory computer readable medium. The computer program product comprises computer code to display a plurality of first indicia presented in a list, where each first indicia indicates a software product, and computer code to display a second indicia associated with a highlighted one of the first indicia. The second indicia comprises information about the software product indicated by the highlighted first indicia. The computer program product additionally comprises computer code to display a third indicia associated with the highlighted first indicia and indicate the availability of a software update for the software product indicated by the highlighted first indicia, and computer code to display a fourth indicia associated with the highlighted first indicia. The fourth indicia facilitates the retrieval of the software update.

Abstract: A wafer is provided having a chip side and a non-chip side, the chip side comprising a plurality of semiconductor chips. A plurality of dies are provided, each of the dies is bonded to one of the plurality of semiconductor chips. One or more trenches are formed on the chip side of the wafer. The chip side of the wafer and the plurality of dies are encapsulated with a protecting material, the protecting material substantially filling the one or more trenches. The wafer is diced to separate it into individual semiconductor packages.

Abstract: A system and method update client computers of various end users with software updates for software products installed on the client computers. The system includes a service provider computer system, a number of client computers and software vendor computer systems communicating on a common network. The service provider computer system stores in an update database information about the software updates of diverse software vendors, identifying the software products for which software updates are available, information for identifying in the client computers the software products stored thereon, and information for determining for such products, which have software updates available. Users of the client computers connect to the service provider computer and obtain a current version of portions of the database.

Abstract: A system, method and computer program product are provided for uninstalling software on a computer. In use, a plurality of software products identified on a computer is displayed. Further, a first user instruction to uninstall at least a portion of at least one of the software products from the computer is received. Such first user instruction is received via an interface. Still yet, the at least a portion of the at least one software product is uninstalled from the computer, in response to the receipt of the first user instruction. Also, a second user instruction may be received to cancel the uninstallation. Thus, the uninstallation may be cancelled, in response to the receipt of the second user instruction.

Abstract: A optical control sensor system includes a driver controlling an operation of a light source coupled to an end of an optical fiber, an orthogonal signal generator, generating a set of different orthogonal signals controlling the driver, a terminal sensor coupled to another end of the optical fiber selecting a predetermined set of input orthogonal signals for converting them into component combinations, constituting output signals, and directing the output signals back to the optical fiber, a device coupled to the light sources and to the first end of the optical fiber for extracting output signals that have passed through a return path in the optical fiber, a detector converting optical output signals into electrical signals, and a selector and a decoder connected to the orthogonal signal generator indicating a current state of the optical control sensor system based on an analysis of the selected combinations of components in the output signals.

Abstract: A semiconductor wafer is fabricated. The wafer has a plurality of dies. The plurality of dies include at least operable dies of a first type and operable dies of a second type different from the first type. The dies of the second type are rendered inoperable, while keeping the dies of the first type operable. The wafer is provided with the operable dies of the first type and the inoperable dies of the second type on it, for testing of the dies of the first type.

Abstract: A system, method and computer program product are provided for uninstalling software on a computer. In use, a plurality of software products identified on a computer is displayed. Further, a first user instruction to uninstall at least a portion of at least one of the software products from the computer is received. Such first user instruction is received via an interface. Still yet, the at least a portion of the at least one software product is uninstalled from the computer, in response to the receipt of the first user instruction. Also, a second user instruction may be received to cancel the uninstallation. Thus, the uninstallation may be cancelled, in response to the receipt of the second user instruction.

Abstract: A semiconductor wafer is fabricated. The wafer has a plurality of dies. The plurality of dies include at least operable dies of a first type and operable dies of a second type different from the first type. The dies of the second type are rendered inoperable, while keeping the dies of the first type operable. The wafer is provided with the operable dies of the first type and the inoperable dies of the second type on it, for testing of the dies of the first type.

Abstract: A wafer is provided having a chip side and a non-chip side, the chip side comprising a plurality of semiconductor chips. A plurality of dies are provided, each of the dies is bonded to one of the plurality of semiconductor chips. One or more trenches are formed on the chip side of the wafer. The chip side of the wafer and the plurality of dies are encapsulated with a protecting material, the protecting material substantially filling the one or more trenches. The wafer is diced to separate it into individual semiconductor packages.