Abstract: One embodiment provides a method of testing humidity, comprising: determining a property of a device which encloses a plurality of interferometric modulators; and determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property. In one embodiment, the property of the device includes one of the following: i) a weight of the device, ii) a color change of a desiccant enclosed in the device, iii) a resistance inside the device, iv) whether frost formed in an inside area of the device which is contacted by a cold finger device, v) whether a desiccant enclosed in the device, when water vapor is provided into the device, is working properly, and vi) combination of at lest two of i)-v).

Abstract: In various embodiments of the invention, an interferometric light modulating display device is provided having a touchscreen above the light modulating display device. The touchscreen may have a diffusing material that may be part of the touchscreen. In some embodiments, the diffusing material may be used to reduce or minimize the color-shift or may be used to change the properties of light reflected by the display such that light modulating display device appears more diffuse and less specularly reflecting. In other embodiments, a light source is provided beneath the touchscreen and one or more reflective surfaces are provided such that at least a portion of the light from the light source that is directed toward the touchscreen is reflected to the light modulating device without passing through the touchscreen. In other embodiments, a diffusing material is provided that may scatter light using different sized scatterers.

Abstract: Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device. In some embodiments, analysis of the process control monitors may utilize optical measurements.

Abstract: An interferometric modulator manufactured according to a particular set of processing parameters may have a non-zero offset voltage. A process has been developed for modifying the processing parameters to shift the non-zero offset voltage closer to zero. For example, the process may involve identifying a set of processing parameters for manufacturing an interferometric modulator that results in a non-zero offset voltage for the interferometric modulator. The set of processing parameters may then be modified to shift the non-zero offset voltage closer to zero. For example, modifying the set of processing parameters may involve modifying one or more deposition parameters used to make the interferometric modulator, applying a current (e.g., a counteracting current) to the interferometric modulator, and/or annealing the interferometric modulator. Interferometric modulators made according to the set of modified processing parameters may have improved performance and/or simpler drive schemes.

Abstract: Embodiments include methods and devices for controlling the spectral profile and color gamut of light produced by an interferometric display. Such devices include illuminating a display with selected wavelengths of light. Embodiments also include a display comprising separate sections that output different predetermined colors of light. Other embodiments include methods of making the aforementioned devices.

Abstract: Apparatus and methods of actuating MEMS display elements are disclosed. The disclosed embodiments can be incorporated into other drive schemes for MEMS display elements. In one embodiment, an apparatus for controlling a MEMS display element to display a frame of video data, said MEMS display element comprising a portion of an array of MEMS display elements, includes an array controller configured to assert a potential difference on said MEMS display element during a first portion of a frame display write process to place the MEMS display element in a first display state, and to assert a potential difference on said MEMS display element during a second portion of the frame display write process to place the MEMS display element in a second display state to display the frame of the video data, where the first display state is different from the second display state.

Abstract: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract: An ornamental display device having an interferometric modulator for displaying an ornamental image. The ornamental device may have a patterned diffuser formed on a transparent substrate to provide an ornamental image. The ornamental device may also be a piece of jewelry or an article that may be worn. The image displayed may have an iridescent appearance. A controller may also be used to control images displayed on multiple ornamental device to provide coordinated images based on externals received or pre-programmed images.

Abstract: Disclosed are methods and systems for testing electronic devices for leak detection, wherein the test does not destroy the electronic devices. In one method of detecting a leak in a sealed package, a sealed package is placed in a test gas environment, thereby allowing the test gas to diffuse into an internal space of the sealed package through a leak formed in the sealed package. Thereafter, the sealed package is placed in an environment substantially free of the test gas and allowing the test gas to diffuse out of the internal space. The amount of the test gas in the test gas-free environment is detected. Based on the information obtained from the detection, it is determined whether the sealed package has one or more unintended leaks based on information obtained from the detecting.

Abstract: Disclosed herein are systems and methods for measuring color and contrast in specular reflective devices such as interferometric modulators. To make color and contrast determinations, light reflected from a specular reflective device may be measured in-line with illumination of the device. The measurements may include measuring the spectra of light reflected from the device being tested as well as from specular bright and dark standards. The spectra may be used to determine a reflectance spectrum and color parameters for the specular reflective device.

Abstract: An etching chamber is configured to support a MEMS substrate within the chamber. The etching chamber is configured to be relatively easy to move and attach to an etch station that includes a source of vapor or gaseous etchant, a source of purge gas and/or a vacuum source. The portable etching chamber may facilitate a process for etching the MEMS substrate contained therein. For example, a MEMS substrate in such an etching chamber may be etched by connecting the chamber into an etch station and exposing the MEMS substrate to an etchant in order to etch the MEMS substrate. The substrate can be moved to or from the etch station within the portable etching chamber. In preferred embodiments, the MEMS substrate is an interferometric modulator and the etchant is XeF2.

Abstract: A method is provided for visual inspection of an array of interferometric modulators in various driven states. This method may include driving multiple columns or rows of interferometric modulators via a single test pad or test lead, and then observing the array for discrepancies between the expected optical output and the actual optical output of the array. This method may particularly include, for example, driving a set of non-adjacent rows or columns to a state different from the intervening rows or columns, and then observing the optical output of the array.

Abstract: Embodiments include devices and methods for wavelength filtering. For example, one embodiment includes a display comprising a plurality of the display elements each comprising a movable reflector, a first partial reflector, and a second partial reflector. The first partial reflector is positioned at a first distance from the movable reflector and forms a first optical resonant cavity therebetween. The second partial reflector is positioned at a second distance from said first partial reflector and forming a second optical resonant cavity therebetween. In various embodiments, the movable reflector is movable with respect to the first partial reflector to alter the first optical cavity. Other embodiments include a method of making devices.

Abstract: Provided herein is an apparatus and a method useful for manufacturing MEMS devices. An aspect of the disclosed apparatus provides a substrate comprising an etchable material exposed to a solid-state etchant, wherein the substrate and the solid-state etchant are disposed in an etching chamber. In some embodiments, the solid state etchant is moved into close proximity to the substrate. In other embodiments, a configurable partition is between the substrate and the solid-state etchant is opened. The solid-state etchant forms a gas-phase etchant suitable for etching the etchable material. In some preferred embodiments, the solid-state etchant is solid xenon difluoride. The apparatus and method are advantageously used in performing a release etch in the fabrication of optical modulators.

Abstract: Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device. In some embodiments, analysis of the process control monitors may utilize optical measurements.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: Embodiments include methods and devices for controlling the spectral profile and color gamut of light produced by an interferometric display. Such devices include illuminating a display with selected wavelengths of light. Embodiments also include a display comprising separate sections that output different predetermined colors of light. Other embodiments include methods of making the aforementioned devices.

Abstract: Systems and methods for driving a display of MEMS devices are disclosed. In one embodiment, a display includes an array comprising a plurality of interferometric modulators, and a driving circuit coupled to said array, said driving circuit configured to provide actuation signals to drive said array based on a temperature of the display. In another embodiment, a method of driving an array having a plurality of interferometric modulators configured into a display is disclosed, where the method includes sensing the temperature at a predetermined location in display, communicating a signal based on the sensed temperature to a display driver, generating an actuation signal to drive said display based on the received signal, and providing the actuation signal to the array.

Abstract: Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device. In some embodiments, analysis of the process control monitors may utilize optical measurements.

Abstract: Methods of writing display data to MEMS display elements are configured to minimize charge buildup and differential aging. The methods may include writing data with opposite polarities, and periodically releasing and/or actuating MEMS elements during the display updating process. Actuating MEMS elements with potential differences higher than those used during normal display data writing may also be utilized.