Abstract: A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.

Abstract: Logic array devices having complex macro-cell architecture and methods facilitating use of same. A semiconductor device comprising an array of logic cells and programmable metal includes gate structures that are pre-wired, where, inputs and/or outputs are available for routing in programmable metal, possibly as part of a hybrid process. The device can also include selectable, in-line inverters, which can share the input/output tracks with logic inputs. A bubble-pushing algorithm can take advantage of the selectable in-line inverters to reduce the number of inverters in a design. In some embodiments, an embedded clock line is common to a plurality of logic cells. The clock line is terminated in a clock cell, which can include test logic, so that a clock group is formed. Flexibility to power down cells, or groups of cells can be provided by power traces with programmable connections.

Abstract: An application-specific integrated circuit (ASIC) is customized using two non-adjacent via layers. An array of logic cells, each including a plurality of logic devices, are arranged in a plurality of non-customized base layers. A first routing grid, which includes a first non-customized metal routing layer, a customized via layer, and a second non-customized metal routing layer, is disposed on top of the plurality of non-customized layers. A second routing grid, which includes a third non-customized metal routing layer, another customized via layer, and a fourth non-customized metal routing layer, is disposed above the first routing grid. A non-customized via layer is disposed above the first routing grid and beneath the second routing grid. The routing grids and the non-customized via layer collectively facilitate routing connections to and from the logic cells.

Abstract: A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.

Abstract: A semiconductor device having a plurality of layers and a capacitor array that includes a plurality of individual capacitors. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections and capacitances of the plurality of individual capacitors in the capacitor array. The semiconductor device may include a metal structure disposed within the device to provide an electromagnetic shield for at least one of the plurality of individual capacitors in the capacitor array.

Abstract: Logic array devices having complex macro-cell architecture and methods facilitating use of same. A semiconductor device comprising an array of logic cells and programmable metal includes gate structures that are pre-wired, where, inputs and/or outputs are available for routing in programmable metal, possibly as part of a hybrid process. The device can also include selectable, in-line inverters, which can share the input/output tracks with logic inputs. A bubble-pushing algorithm can take advantage of the selectable in-line inverters to reduce the number of inverters in a design. In some embodiments, an embedded clock line is common to a plurality of logic cells. The clock line is terminated in a clock cell, which can include test logic, so that a clock group is formed. Flexibility to power down cells, or groups of cells can be provided by power traces with programmable connections.

Abstract: Logic array devices having complex macro-cell architecture and methods facilitating use of same. A semiconductor device comprising an array of logic cells and programmable metal includes gate structures that are pre-wired, where, inputs and/or outputs are available for routing in programmable metal, possibly as part of a hybrid process. The device can also include selectable, in-line inverters, which can share the input/output tracks with logic inputs. A bubble-pushing algorithm can take advantage of the selectable in-line inverters to reduce the number of inverters in a design. In some embodiments, an embedded clock line is common to a plurality of logic cells. The clock line is terminated in a clock cell, which can include test logic, so that a clock group is formed. Flexibility to power down cells, or groups of cells can be provided by power traces with programmable connections.

Abstract: An application-specific integrated circuit (ASIC) is customized using two non-adjacent via layers. An array of logic cells, each including a plurality of logic devices, are arranged in a plurality of non-customized base layers. A first routing grid, which includes a first non-customized metal routing layer, a customized via layer, and a second non-customized metal routing layer, is disposed on top of the plurality of non-customized layers. A second routing grid, which includes a third non-customized metal routing layer, another customized via layer, and a fourth non-customized metal routing layer, is disposed above the first routing grid. A non-customized via layer is disposed above the first routing grid and beneath the second routing grid. The routing grids and the non-customized via layer collectively facilitate routing connections to and from the logic cells.

Abstract: A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.

Abstract: A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.

Abstract: A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.

Abstract: Logic cells in an application-specific integrated circuit (ASIC) emulating standard gate sizing by duplicating elements within a single standard gate where logical high-drive gates are synthesized and converted to parallel elements as a post-process. The drive characteristics of the logical gates are retained during the conversion to the physical gate equivalents in the standard cell architecture. The logic cells in the device may include, for example, at least two two-input multiplexers.

Abstract: Logic cells in an application-specific integrated circuit (ASIC) emulating standard gate sizing by duplicating elements within a single standard gate where logical high-drive gates are synthesized and converted to parallel elements as a post-process. The drive characteristics of the logical gates are retained during the conversion to the physical gate equivalents in the standard cell architecture. The logic cells in the device may include, for example, at least two two-input multiplexors.

Abstract: A semiconductor device having a plurality of layers and a capacitor array that includes a plurality of individual capacitors. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections and capacitances of the plurality of individual capacitors in the capacitor array. The semiconductor device may include a metal structure disposed within the device to provide an electromagnetic shield for at least one of the plurality of individual capacitors in the capacitor array.

Abstract: Customization of structured ASIC devices using pre-process extraction of routing information. Embodiments of the invention can enable a router that can automatically extract a routing graph for a structured ASIC, where the routing graph represents available routing resources on fixed metal layers. The routing graph can be extracted as a pre-process, and saved in a technology file for later use by the router. Additionally, each unique fixed metal wire type found in the layout can be characterized with a master wire definition, including resistance and capacitance estimates. In some embodiments, a global-routing graph can further be extracted from a detailed routing graph.

Abstract: Logic array devices having complex macro-cell architecture and methods facilitating use of same. A semiconductor device comprising an array of logic cells and programmable metal includes gate structures that are pre-wired, where, inputs and/or outputs are available for routing in programmable metal, possibly as part of a hybrid process. The device can also include selectable, in-line inverters, which can share the input/output tracks with logic inputs. A bubble-pushing algorithm can take advantage of the selectable in-line inverters to reduce the number of inverters in a design. In some embodiments, an embedded clock line is common to a plurality of logic cells. The clock line is terminated in a clock cell, which can include test logic, so that a clock group is formed. Flexibility to power down cells, or groups of cells can be provided by power traces with programmable connections.

Abstract: Logic array devices having complex macro-cell architecture and methods facilitating use of same. A semiconductor device comprising an array of logic cells and programmable metal includes gate structures that are pre-wired, where, inputs and/or outputs are available for routing in programmable metal, possibly as part of a hybrid process. The device can also include selectable, in-line inverters, which can share the input/output tracks with logic inputs. A bubble-pushing algorithm can take advantage of the selectable in-line inverters to reduce the number of inverters in a design. In some embodiments, an embedded clock line is common to a plurality of logic cells. The clock line is terminated in a clock cell, which can include test logic, so that a clock group is formed. Flexibility to power down cells, or groups of cells can be provided by power traces with programmable connections.

Abstract: Distributed RAM in a logic array. A single, customizable, logic array fabric provides both gate array logic and RAM functionality simultaneously while substantially maximizing the amount of configurable metal for routing. The extra semiconductor area in the cells of a metal limited device is used to implement general purpose RAM. Common select lines and read/write lines for the RAM are embedded in the base cells so that the configurable metal (whether via or actual metal layer) over the RAM can be used for routing logic.

Abstract: Logic array devices having complex macro-cell architecture and methods facilitating use of same. A semiconductor device comprising an array of logic cells and programmable metal includes gate structures that are pre-wired, where, inputs and/or outputs are available for routing in programmable metal, possibly as part of a hybrid process. The device can also include selectable, in-line inverters, which can share the input/output tracks with logic inputs. A bubble-pushing algorithm can take advantage of the selectable in-line inverters to reduce the number of inverters in a design. In some embodiments, an embedded clock line is common to a plurality of logic cells. The clock line is terminated in a clock cell, which can include test logic, so that a clock group is formed. Flexibility to power down cells, or groups of cells can be provided by power traces with programmable connections.

Abstract: A semiconductor device and method of testing the device having a plurality of logic cells interconnected using vias to connect routing tracks that are disposed among a plurality of layers in the device. The logic cells in the device including at least two three-input look-up tables, one two-input look-up table and a flip-flop. The components in the logic cell are connected so that any look-up table can drive at least one input of any other look-up table and where the flip-flop is connected to the look-up tables so that any look-up table can drive an input of the flip-flop.