Patents by Inventor William D. Killen

William D. Killen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040189528
    Abstract: A slot fed microstrip patch antenna (300) includes a conducting ground plane (308), the conducting ground plane (308) including at least one slot (306). A dielectric material is disposed between the ground plane (308) and at least one feed line (317), wherein at least a portion of the dielectric layer (313) includes magnetic particles (324). The dielectric layer between the feed line (317) and the ground plane (308) provides regions having high relative permittivity (313) and low relative permittivity (312). At least a portion of the stub (318) is disposed on the high relative permittivity region (313).
    Type: Application
    Filed: March 31, 2003
    Publication date: September 30, 2004
    Inventors: William D. Killen, Randy T. Plke, Heriberto Jose Delgado
  • Patent number: 6794952
    Abstract: A printed circuit (100) for processing radio frequency signals includes a substrate (110) including substrate regions (101, 103, 105, 111, and 119) upon which the printed circuit can be placed. The circuit is a lowpass filter including a transformer line section (112), at least a first stub section (114 or 116), and transmission line sections (117) interconnecting the transformer line section with at least the first stub section. The transformer line section, the transmission line sections, and at least the first stub section are coupled to respective substrate regions that have substrate characteristics that are each independently customizable. The circuit further comprises at least one ground or ground plane (120) coupled to the substrate.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: September 21, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6791496
    Abstract: A slot fed microstrip antenna (100) having an improved stub (118) provides enhanced efficiency through more efficient coupling of electromagnetic energy between the feed line (117) and the slot (106). A dielectric layer (105) disposed between the feed line (117) and the ground plane (108) provides a first region (112) having a first relative permittivity and at least a second region (113) having a second relative permittivity. The second relative permittivity is higher as compared to the first relative permittivity. The stub (118) is disposed on the high permittivity region (113). The dielectric layer can include magnetic particles, which are preferably disposed underlying the stub.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: September 14, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike, Heriberto Jose Delgado
  • Publication number: 20040164907
    Abstract: A slot fed microstrip antenna (100) provides improved efficiency through enhanced coupling of electromagnetic energy between the feed line (117) and the slot (106). The dielectric layer (105) between the feed line (117) and the slot (106) includes magnetic particles (114), the magnetic particles (114) preferably included in the dielectric junction region (113) between the microstrip feed line (117) and the slot (106). A high dielectric region is preferably also provided in the junction constant to further enhance the field concentration effect. The slot antenna (100) can be embodied as a microstrip patch antenna (200).
    Type: Application
    Filed: February 25, 2003
    Publication date: August 26, 2004
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6781486
    Abstract: An RF filter that includes a substrate having a plurality of regions, each having respective substrate properties including a relative permeability and a relative permittivity. At least one filter section is coupled to one of the regions of the substrate which has different substrate properties in comparison to other regions. Other filter sections can be coupled to other substrate regions having different substrate properties. The permeability and/or permittivity can be controlled by the addition of meta-materials to the substrate and/or by the creation of voids in the substrate. The RF filter can be a stepped impedance filter. One filter section includes a transmission line section having an impedance influenced by the region of the substrate on which the filter section is disposed. The transmission line section construction can be a microstrip, buried microstrip, or stripline. A supplemental layer of the substrate can be disposed beneath the filter section.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: August 24, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6753814
    Abstract: The invention concerns a dipole antenna of reduced size and with improved impedance bandwidth. The antenna is preferably formed on a dielectric substrate having a plurality of regions, each having a characteristic relative permeability and permittivity. First and second dipole radiating element defining conductive paths can be selectively formed on first characteristic regions of the substrate having a first characteristic permeability and first permittivity. A reactive coupling element can be interposed between the dipole radiating elements for reactively coupling the first dipole radiating element to the second dipole radiating element.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: June 22, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6753744
    Abstract: A circuit (100) for processing radio frequency signals includes a substrate (50) where the circuit can be placed. The substrate can be a meta-material and can incorporate at least one dielectric layer (20, 30, or 40). The circuit such as a three port circuit and at least one ground can be coupled to the substrate. The dielectric layer can include a first region (40) with a first set of substrate properties and a second region (20) with a second set of substrate properties. Substrate properties can include permittivity and permeability. A portion (32 or 46) of the three port circuit can be selectively coupled to the second region. The permittivity and/or permeability of the second region can be higher than the permittivity and/or permeability of the first region. The increased permittivities and/or permeabilities can reduce a size of the three port circuit and effect a change in a variety of electrical characteristics associated with the three port circuit.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: June 22, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6753745
    Abstract: A circuit for processing radio frequency signals. The circuit includes a substrate where the circuit can be placed. The substrate can be a meta-material and can incorporate at least one dielectric layer. A four port circuit and at least one ground can be coupled to the substrate. The dielectric layer can include a first region with a first set of substrate properties and a second region with a second set of substrate properties. Substrate properties can include permittivity and permeability. A substantial portion of the four port circuit can be coupled to the second region. The permittivity and/or permeability of the second region can be higher than the permittivity and/or permeability of the first region. The increased permittivities and/or permeabilities can reduce a size of the four port circuit and effect a change in a variety of electrical characteristics associated with the four port circuit.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: June 22, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6750820
    Abstract: An antenna formed on a dielectric substrate including at least a first and second dielectric substrate region. One or more antenna-radiating element is formed on the first region of the dielectric substrate and defines a conductive path. Feed circuitry for the antenna can be formed on the second region of the dielectric substrate. The feed circuitry can comprise a balun, an impedance transformer, and/or a feed line. The dielectric substrate in the first region can preferably have a first relative permeability and/or first permittivity different from a second relative permeability and/or a second permittivity of the dielectric substrate of the second region.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: June 15, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6750740
    Abstract: A printed circuit for processing radio frequency signals includes a substrate including substrate regions upon which the printed circuit can be placed. The circuit is an interdigital filter including a plurality of resonator elements. The plurality of resonator line elements are at least partially coupled to respective substrate regions that have substrate characteristics that are each independently customizable. The circuit further comprises at least one ground or ground plane (50) coupled to the substrate.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: June 15, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Publication number: 20040104847
    Abstract: A slot fed microstrip patch antenna (200) includes an electrically conducting ground plane (208), the ground plane (208) having at least one coupling slot (206) and at least a first patch radiator (209). An antenna dielectric substrate material (205) is disposed between the ground plane (208) and the first patch radiator (209), wherein at least a portion of the antenna dielectric (210) includes magnetic particles (214). A feed dielectric substrate (212) is disposed between a feed line (217) and the ground plane. (208). Magnetic particles can also be used in the feed line (217) dielectric. Patch antennas according to the invention can be of a reduced size through use of high relative permittivity dielectric substrate portions, yet still be efficient through use of dielectrics including magnetic particles which permit impedance matching of dielectric medium interfaces, such as the feed line (217) into the slot (206).
    Type: Application
    Filed: December 3, 2002
    Publication date: June 3, 2004
    Inventors: William D. Killen, Randy T. Pike, Heriberto Jose Delgado
  • Patent number: 6741148
    Abstract: A printed circuit for processing radio frequency signals includes a substrate including substrate regions upon which the printed circuit can be placed. The circuit is a coupled line filter including a plurality of resonator elements. The plurality of resonator line elements are at least partially coupled to respective substrate regions that have substrate characteristics that are each independently customizable. The circuit further comprises at least one ground or ground plane (50) coupled to the substrate.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 25, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6737932
    Abstract: The invention concerns an impedance transforming device that includes a dielectric circuit board substrate. The substrate has at least one region that has a relative permeability or a relative permittivity different from a remaining portion of the substrate. In order to control the permeability and permittivity, in this way, meta-materials can be used to selectively modify portions of the substrate. A transmission line transformer is disposed on the substrate and coupled to the region.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 18, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6734827
    Abstract: A printed circuit log periodic dipole array (LPDA) includes dipole elements with arms having reduced size through use of high effective permittivity substrate portions. The radiation efficiency degradation generally associated with use of a high permittivitty substrate can be reduced through addition of magnetic particles to provide enhanced permeability in the high permittivity regions. The substrate preferably includes meta-materials. The feed line can provide a broadband transformation by being configured as a plurality of segments having quarter wave electrical lengths.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 11, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6731244
    Abstract: A circuit for processing radio frequency signals. The circuit includes a substrate where the circuit can be placed. The substrate can be a meta material and can incorporate at least one dielectric layer (100). A directional coupler (106) and at least one ground (112) can be coupled to the substrate. The dielectric layer can include a first region (102) with a first set of substrate properties and a second region (104) with a second set of substrate properties. The substrate properties can include a permittivity and a permeability. A substantial portion of the directional coupler (106) can be coupled to the second region (104). The permittivity and/or permeability of the second region (104) can be higher than the permittivity and/or permeability of the first region (102). The increased permittivities and/or permeabilities can reduce a size of the directional coupler (106) and effect a change in a variety of electrical characteristics associated with the directional coupler (106).
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 4, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6731248
    Abstract: A printed circuit array of log periodic dipole arrays (LPDA) where each LPDA includes dipole elements with arms having reduced size through use of high effective permittivity substrate portions. The radiation efficiency degradation generally associated with use of a high permittivitty substrate can be be reduced through addition of magnetic particles to provide enhanced permeability in the high permittivity regions. The substrate preferably includes meta-materials. The feed line can provide a broadband transformation by being configured as a plurality of segments having quarter wave electrical lengths.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 4, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6731246
    Abstract: The invention concerns an efficient loop antenna of reduced size. The antenna is formed on a dielectric substrate disposed on a conductive ground plane. The substrate has a plurality of regions of differing substrate characteristics. An elongated conductive antenna element is arranged in the form of a loop and disposed on a first region of the substrate. The antenna element can have first and second adjacent end portions separated by a gap. The first region of the substrate has a relative permeability that is higher as compared to a second region of the substrate on which the remainder of the circuitry is disposed. According to one aspect of the invention, the relative permeability of the first region is greater than 1.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: May 4, 2004
    Assignee: Harris Corporation
    Inventors: Francis Parsche, William D. Killen, Randy T. Pike
  • Patent number: 6727785
    Abstract: A printed circuit for processing radio frequency signals. The printed circuit includes a substrate. The substrate can be a meta material and can include at least one dielectric layer. The dielectric layer can have a first set of dielectric properties over a first region and a second set of dielectric properties over a second region. The dielectric permittivity and/or magnetic permeability of the second set of dielectric properties can be different than the first set of dielectric properties. The printed circuit also can include a single port resonant line and a ground coupled to the substrate. The dielectric properties can be controlled to adjust the size of the resonant line. The dielectric properties also can be controlled to adjust an impedance, quality factor and/or capacitance on the resonant line. Resonant characteristics of the resonant line can be distributed through the substrate.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: April 27, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6720926
    Abstract: A reactive element of selected value is integrated within a circuit board substrate. At least one conductive path is provided for defining a circuit element. The conductive path is selectively formed on first characteristic regions of a circuit board substrate. The substrate in the first characteristic regions can have a first permeability and first permittivity. One or more reactive elements can be interposed between portions of the conductive path. In particular, the reactive element can be formed on a second characteristic region of the substrate having a second permittivity and second permeability. Either the first permittivity, the first permeability, or both characteristics of the first regions can be different respectively from the second permittivity and the second permeability of the second characteristic region of the substrate.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: April 13, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike
  • Patent number: 6700463
    Abstract: A transmission line structure for reduced coupling of signals between circuit elements. The structure includes an RF transmission line disposed on a circuit board (100) formed from a dielectric substrate material. The RF transmission line includes an elongated conductive metal trace (110) and has opposed elongated edge portions. The structure also includes a pair of elongated substrate boundary regions (105) coextensive with at least a portion of the elongated conductive metal trace (110). Each of the boundary regions (105) is positioned adjacent to a respective one of the opposing edge portions to define an elongated substrate channel region (205). A pair of conductive metal traces (410) can be disposed on the substrate channel region (205) within the substrate boundary regions (105). The conductive metal traces (410) are spaced apart by an intermediate substrate region (405) and are parallel to each other.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: March 2, 2004
    Assignee: Harris Corporation
    Inventors: William D. Killen, Randy T. Pike