Patents by Inventor William D. Scharf

William D. Scharf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7831653
    Abstract: A partially manufactured semiconductor chip comprising a slice and a number of shells is a template for a communication and networking chip. The slice has a number of I/O ports, blocks, and PHYs. The hardmac PHYs are established to correspond to a high speed data transmission protocol. The interior of the template comprises logic gate arrays and configurable memory. Once particular protocols of data receipt and transmission are selected, the logic gate arrays and configurable memory can be programmed and otherwise configured to develop protocol layers for data networking and communication.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: November 9, 2010
    Assignee: LSI Corporation
    Inventors: George Wayne Nation, Gary Scott Delp, William D. Scharf, Narayanan Raman, John N. Fryar, III, Majid Bemanian
  • Patent number: 7185301
    Abstract: The present invention is a method and apparatus for implementing a source synchronous interface in a platform using a Generic Source Synchronous Interface (GSSI) infrastructure. The GSSI infrastructure includes the GSSI bit slices and clock management system. The GSSI bit slice includes balanced cells and bit delay elements, and may be placed either within or close to IO buffers. The GSSI clock management system includes strategically placed frame delay elements with automatic on-chip calibration and control to satisfy various clock-data phase relationships. The GSSI methodology shows how different SSIs may be constructed by combining the common GSSI architecture with unique metal layer configurations. The GSSI architecture solves a critical challenge for platform-based design such as RapidChip™ and the like. The GSSI approach introduces a completely new way to implement various SSIs based on a common minimally diffused GSSI bit slice and clock management infrastructure.
    Type: Grant
    Filed: April 6, 2004
    Date of Patent: February 27, 2007
    Assignee: LSI Logic Corporation
    Inventors: Hong Hao, Keven Hui, William D. Scharf
  • Patent number: 6934597
    Abstract: An integrated circuit (IC) and a method of manufacturing an integrated circuit suited for a particular application. In one embodiment, the IC includes: (1) at least two interfaces, (2) a programmable gate array (PGA) coupled to the at least two interfaces for communicating data therebetween and, optionally (3) a field-programmable gate array (FPGA) coupled to and configured to cooperate with the PGA to adapt the IC to a particular surrounding environment.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: August 23, 2005
    Assignee: LSI Logic Corporation
    Inventors: Majid Bemanian, William D. Scharf
  • Patent number: 6904586
    Abstract: An integrated circuit (IC) and a method of manufacturing an integrated circuit suited for a particular application. In one embodiment, the IC includes at least two interfaces, a field-programmable gate array (FPGA) and a programmable gate array (PGA). The FPGA has a configuration memory associated therewith and is coupled to the at least two interfaces for communicating data therebetween. The PGA is coupled to and configured to cooperate with the FPGA to adapt the IC to a particular surrounding environment.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: June 7, 2005
    Assignee: LSI Logic Corporation
    Inventors: Majid Bemanian, William D. Scharf, Bruce L. Entin
  • Publication number: 20040114622
    Abstract: A partially manufactured semiconductor chip comprising a slice and a number of shells is a template for a communication and networking chip. The slice has a number of I/O ports, blocks, and PHYs. The hardmac PHYs are established to correspond to a high speed data transmission protocol. The interior of the template comprises logic gate arrays and configurable memory. Once particular protocols of data receipt and transmission are selected, the logic gate arrays and configurable memory can be programmed and otherwise configured to develop protocol layers for data networking and communication.
    Type: Application
    Filed: December 13, 2002
    Publication date: June 17, 2004
    Applicant: LSI Logic Corporation
    Inventors: George Wayne Nation, Gary Scott Delp, William D. Scharf, Narayanan Raman, John N. Fryar, Majid Bemanian
  • Patent number: 4393509
    Abstract: A method and apparatus for simulating, in conjunction with a source of ionizing radiation, intense pulsed electromagnetic fields and time varying conductivity caused by the gamma radiation associated with a nuclear detonation. An enclosed space, including the source of ionizing radiation is separated into three spaces, each space separated from the adjacent space by a gas impermeable, radiation permeable barrier. A guided wave structure, pulsed with high voltage pulses in conjunction with the firing of the source of ionization radiation is disposed adjacent to the barrier separating two of the spaces. A gas handling system is provided to introduce a selected non-ionizing gas and a selected ionizing gas into the spaces on either side of the barrier adjacent to the guided wave structure.
    Type: Grant
    Filed: April 10, 1981
    Date of Patent: July 12, 1983
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: George Merkel, William D. Scharf