Abstract: A switching converter produces an output signal transmitted to a variable load impedance to produce a load voltage VDD across the load impedance and holds VDD close to a set point voltage VSP selected by control data DREF1 to compensate for variations in the load impedance which tend to drive VDD away from VSP. The switching converter includes a pulse-width modulated power converter for producing the output signal of voltage VOUT in response to an input signal of voltage VIN, wherein a ratio VOUT/VIN is a function of a duty cycle D1 of a pulse-width modulated signal VPWM1. A pulse-width modulation circuit generates the VPWM signal of duty cycle D1 controlled by a control signal, and a feedback control circuit monitoring the load voltage VDD adjusts D1 to keep the load voltage as close as possible to VSP. A power source supplies the input signal of voltage VIN to the power converter.

Abstract: A switching converter produces an output signal transmitted to a variable load impedance to produce a load voltage VDD across the load impedance and holds VDD close to a set point voltage VSP selected by control data DREF1 to compensate for variations in the load impedance which tend to drive VDD away from VSP. The switching converter includes a pulse-width modulated power converter for producing the output signal of voltage VOUT in response to an input signal of voltage VIN, wherein a ratio VOUT/VIN is a function of a duty cycle D1 of a pulse-width modulated signal VPWM1. A pulse-width modulation circuit generates the VPWM signal of duty cycle D1 controlled by a control signal, and a feedback control circuit monitoring the load voltage VDD adjusts D1 to keep the load voltage as close as possible to VSP. A power source supplies the input signal of voltage VIN to the power converter.

Abstract: A power supply assembly includes a dielectric substrate and a power supply circuit supported by the dielectric substrate. A conductive connection block is attached to the dielectric substrate at a main surface thereof and is connected to a power supply terminal of the power supply circuit. A spring probe pin is fitted in a bore formed in the connection block and includes a conductive sleeve and a conductive plunger fitted in the sleeve. The conductive sleeve is in electrically conductive contact with the connection block.

Abstract: A power supply assembly includes a dielectric substrate and a power supply circuit supported by the dielectric substrate. A conductive connection block is attached to the dielectric substrate at a main surface thereof and is connected to a power supply terminal of the power supply circuit. A spring probe pin is fitted in a bore formed in the connection block and includes a conductive sleeve and a conductive plunger fitted in the sleeve. The conductive sleeve is in electrically conductive contact with the connection block.

Abstract: A test head for a semiconductor integrated circuit tester, the test head includes a power supply board mounted to a power distribution board and positioned between the power distribution board and a device interface board. The power supply board includes a power supply circuit having power supply input terminals for receiving electrical power at a voltage Vin and force and return terminals for supplying regulated electrical power at a voltage Vout. The power supply board further includes a power connector for connecting the force and return terminals of the power supply circuit to power supply contact elements of the device interface board.

Abstract: An integrated circuit (IC) tester includes a set of power modules mounted in a test head, each contacting a device interface board (DIB). The DIB provides power paths for delivering an output current generate by each power module to a power input terminals of one or more IC devices under test (DUTs). Power modules that supply current to the same set of DUTs communicate with one another though conductive paths provided by the DIB to ensure that all power modules begin supplying load current to that set of DUTs at the same time and to ensure that all power modules supply substantially the same amount of load current to those DUTs.

Abstract: A test head for a semiconductor integrated circuit tester, the test head includes a power supply board mounted to a power distribution board and positioned between the power distribution board and a device interface board. The power supply board includes a power supply circuit having power supply input terminals for receiving electrical power at a voltage Vin and force and return terminals for supplying regulated electrical power at a voltage Vout. The power supply board further includes a power connector for connecting the force and return terminals of the power supply circuit to power supply contact elements of the device interface board.

Abstract: An integrated circuit (IC) tester includes a set of power modules mounted in a test head, each contacting a device interface board (DIB). The DIB provides power paths for delivering an output current generate by each power module to a power input terminals of one or more IC devices under test (DUTs). Power modules that supply current to the same set of DUTs communicate with one another though conductive paths provided by the DIB to ensure that all power modules begin supplying load current to that set of DUTs at the same time and to ensure that all power modules supply substantially the same amount of load current to those DUTs.