Abstract: In some embodiments, the present disclosure relates to a system. The system includes a substrate and a fluid capture material formed on one or more surfaces of the substrate. The fluid capture material includes a sorbent material that binds one or more fluids, the one or more fluids comprising water, carbon dioxide, sulfur oxides, or a combination thereof. The fluid capture material also includes one or more binder materials, wherein the binder material is at least partially cross-linked.

Abstract: An semiconductor device package (10) with improved thermal properties that limits unwanted parasitics and provides a more consistent distribution of parasitics from one device to another. The package of the present invention (10) is extremely compact and uses, in one embodiment, a minimal length of bond wires (20 and 22) between the terminals (14 and 16) and the attached device (30). The path length of the package (10) is reduced so as to represent only some fraction of a wavelength relative to the terminals (14 and 16) of the package (10). By reducing the length of the bond wires (20 and 22) and selecting the appropriate dielectric constant of the encapsulant (12), the invention provides a package (10) with a unique hexagonal structure that limits the effects of parasitics and provides good thermal dissipation. In a second and third embodiment of the present invention, the semiconductor device package (10) is useful in optoelectronic devices such light emitting diodes with an anode (71) and a cathode (72).