Abstract: A mechanism is provided for addressing coupled noise-based violations. For each net in an integrated circuit (IC) design, a determination is made as to whether an associated delta wire delay is below a predetermined threshold. Responsive to the associated delta wire delay failing to be below the predetermined threshold, a subset of nets is formed. For each net in the subset of nets, a stage delay side model of the net is adjusted to emulate a noise impact on timing of the net and an optimization is applied using the stage delay side model of the net. A full retiming of the set of nets is then performed. For each net in the subset of nets a determination is made as to whether the net has degraded slack and, responsive to the net having degraded slack, the applied optimization is backed out.

Abstract: A mechanism is provided for addressing coupled noise-based violations. For each net in an integrated circuit (IC) design, a determination is made as to whether an associated delta wire delay is below a predetermined threshold. Responsive to the associated delta wire delay failing to be below the predetermined threshold, a subset of nets is formed. For each net in the subset of nets, a stage delay side model of the net is adjusted to emulate a noise impact on timing of the net and an optimization is applied using the stage delay side model of the net. A full retiming of the set of nets is then performed. For each net in the subset of nets a determination is made as to whether the net has degraded slack and, responsive to the net having degraded slack, the applied optimization is backed out.

Abstract: A method for eliminating negative slack in a netlist representing a chip design uses a contrived timing environment to overlay information onto the design environment during logic and physical synthesis phase. The overlaid timing information determines which netlist transformation provides a maximum leverage for the negative slack elimination and a way for creating a dynamic transformation recipe tuned for each design. The method further provides upper bounds on the negative slack elimination to prevent the netlist transforms from being applied to situations exceeding the capabilities for improving the design.

Abstract: A method for eliminating negative slack in a netlist representing a chip design uses a contrived timing environment to overlay information onto the design environment during logic and physical synthesis phase. The overlaid timing information determines which netlist transformation provides a maximum leverage for the negative slack elimination and a way for creating a dynamic transformation recipe tuned for each design. The method further provides upper bounds on the negative slack elimination to prevent the netlist transforms from being applied to situations exceeding the capabilities for improving the design.

Abstract: Routability (or wiring congestion) in a VLSI chip is becoming increasingly important as chip complexity increases. Congestion has a significant impact on performance, yield, and chip area. The present invention targets the optimization of congestion early in technology independent synthesis prior to physical design. Instead of attempting to optimize the logic structure as well as the spatial placement of a circuit, we pose a more modest goal limiting such optimization to the scope of logic synthesis. That is, we propose an aggressive optimization approach that is cognizant of circuit structure during technology independent synthesis and produces more predictable implementations which give better routability and yield.

Abstract: A substrate for packaging semiconductor chips is provided which is structured with conductors having opposite ends terminating in a mounting surface and intermediate portions extending beneath the surface. The ends of the conductors are arranged in repeating patterns longitudinally along the substrate separated by orthogonal strips free of conductor ends to allow for dense surface wiring. The repeating patterns are arranged to allow for chip mounting sites having sufficient spacing to allow for surface wiring. In this way chips in the same and repeat pattern can be connected by personalized surface wiring and preset substrate conductors.

Abstract: A method of making an aperture of a predetermined shape into a dielectric substrate which will lockingly receive a deformable contact pin. It includes providing a dielectric material which shrinks in response to a heat treatment by an amount which is different in one direction from that in another direction, and which irreversibly changes dimensions in its two orthogonal directions in proportion to this difference. An aperture is formed in such a material, in a direction normal to the plane of the two orthogonal directions and the material is subjected to a heat treatment that causes a differential shrinkage in the aperture and a change in the shape of the aperture. A deformable contact pin is then forced into a locking position in the aperture.

Abstract: Repair of opens and shorts in semiconductor packages and chip metallurgy by initial conversion of shorts into opens by severing of lines about the shorts, followed by interconnection of conductor patch lines to the good circuit portions through an insulating layer.

Abstract: A device for removing contaminant impurities, particularly contaminants existing at very low levels, from a liquid, including a heating element at least partially immersible in the liquid, a confinement means at least partially immersible in the liquid for maintaining a pulsating bubble of vapor of the liquid, the heating element located within the confining means, openings in the confining means to allow periodic partial escape of the vapor bubble and ingress of liquid.