Abstract: Apparatus and method in which a number of thin, disc-like wafers are moved in an arcuate path while supported in a generally upright position. While so supported, the wafers are indexed between a plurality of cleaning stations which may include a scrub station, a scrub rinse station, a rinse station, and a dry station. In the scrub rinse and/or scrub station, the wafers are rotated while contacted on opposite surfaces thereof by a pair of rotating brushes disposed in a closed position, which brushes may be moved to an open position to accommodate movement of the wafers therebetween. Furthermore, a bracket of unique construction serially moves the wafers into the travel path. Means for introducing the wafers to the path and for removing them therefrom are further included.