Patents by Inventor William F. Bonetti

William F. Bonetti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through-hole plating
    Patent number: 4515829
    Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.
    Type: Grant
    Filed: October 14, 1983
    Date of Patent: May 7, 1985
    Assignee: Shipley Company Inc.
    Inventors: Cheryl A. Deckert, Edward C. Couble, William F. Bonetti