Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.

Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.

Abstract: A connector comprising an insulating body defining a slot that is adapted to receive a pluggable module. A plurality of conductive pins extend into the slot and at least one extension, coupled to the insulating body, protects the plurality of pins from being shorted by an incorrectly inserted pluggable module.

Abstract: A carrier module is physically compatible with a XENPAK/X2 10 GE slot and includes a socket for accepting a non-XENPAK/X2 module and interface circuitry for providing appropriate signals to a XENPAK/X2 70-pin connector on an interior side of the carrier module. The carrier module includes a cookie, accessible by host software, identifying the type of carrier module and non-XENPAK/X2 module accepted by the carrier card.

Abstract: A connector comprising an insulating body defining a slot that is adapted to receive a pluggable module. A plurality of conductive pins extend into the slot and at least one extension, coupled to the insulating body, protects the plurality of pins from being shorted by an incorrectly inserted pluggable module.

Abstract: A system includes a circuit board module having a device mounting section. The system further includes a small form factor transceiver and a form factor converter. The form factor converter is configured to concurrently connect to (i) the circuit board module and (ii) the small form factor transceiver. The form factor converter includes an exterior portion defining a large form factor (e.g., the standard X2 form factor) to fit within the device mounting section of the circuit board module when the form factor converter connects to the circuit board module, and an interior portion defining a small form factor (e.g., the standard SFP form factor) location to receive at least a portion of the small form factor transceiver when the form factor converter connects to the small form factor transceiver.

Abstract: A system for providing dual 10 GB uplinks in the front side of a single rack unit switch that stacks two MSA X2 I/O devices in a limited space. In one embodiment the two X2 I/O devices are mounted on opposite sides of a single circuit board positioned above the motherboard.