Abstract: A method of validating whether a building or building portion has a design target heat loss coefficient is disclosed. According to the method, also known as the VeriTherm method, a plausible range of heat loss coefficients is determined in which an estimated measurement error does not exceed a combined sensor bias. An indication of whether the design target heat loss coefficient is validated is provided depending on whether or not the design target heat loss coefficient is inside the plausible range of heat loss coefficients. An apparatus may include modules adapted to perform the steps of the method. Further, a method of heating or cooling a building portion is disclosed. According to the method a power input to a building portion is determined in dependence on one or more of: a design target heat loss coefficient, a desired maximal internal to external temperature difference, a cut-off temperature, an intended period of measurement, and a heating/cooling period.

Abstract: The present invention provides a sophisticated automated accreditation and certification platform that substantially streamlines the oversight process, reducing the duration of the on-site survey, eliminating paper and allowing for the efficient, electronic transfer of documents. In addition, the online process is interactive, allowing users to get up-front feedback on standards compliance and perform a self-assessment prior to their actual survey.

Abstract: A test system and method for testing a processor circuit board having at least one processor. The system includes a processor control circuit connected to the processor circuit board which enables test routines to be run on the processor of the processor circuit board, a peripheral emulator circuit, having a connector for connecting to at least one peripheral connector on the processor circuit board, for emulating at least one function of at least one peripheral device, a response circuit measuring the response of the processor circuit board to a test routine, a main controller in electronic communication with the processor control circuit and the response circuit. In operation, the processor control circuit receives instructions from the main controller and causes the processor on the processor circuit board to run a test routine. The response circuit will then communicate the results of the test routine to the main controller.

Abstract: A method and apparatus for use with an electronic test system to enable the direct testing of buses on a unit under test (UUT). A connection and interface for an electronic test system are provided, which are simple to use, fast to connect and reliable, which may be used as an extra point of test and/or for testing buses remote from the microprocessor of a circuit under test, and which may also be used independently of any devices of the circuit under test. The test apparatus and method may be used to test buses remote from the microprocessor without the use of peripheral devices on the circuit under test, for example I/O chips.

Abstract: A test system and method for testing a processor circuit board having at least one processor. The system includes a processor control circuit connected to the processor circuit board which enables test routines to be run on the processor of the processor circuit board, a peripheral emulator circuit, having a connector for connecting to at least one peripheral connector on the processor circuit board, for emulating at least one function of at least one peripheral device, a response circuit measuring the response of the processor circuit board to a test routine, a main controller in electronic communication with the processor control circuit and the response circuit. In operation, the processor control circuit receives instructions from the main controller and causes the processor on the processor circuit board to run a test routine. The response circuit will then communicate the results of the test routine to the main controller.

Abstract: A hinge apparatus consisting of a wire hinge, hinge bracket and cover bracket to provide a means for permitting the easy removal of a cover of a protective enclosure without its complete disengagement from the body of the enclosure. The hinge apparatus maintains the attachment of the cover to the main body of the protective enclosure without hindering access to the internal components within the enclosure.

Abstract: The present invention relates to a multi-purpose security enclosure for security devices. The multi-purpose security enclosure is comprised of a mounting base, a protective cover and a securement means. The protective cover is rotatable about 360°.

Abstract: A load monitoring, indicating, and alarm system monitors electrical continuity through an AC electrical load coupled in a first electrical line with an electrical indicator such as an indicating lamp in a second electrical line coupled in parallel with the first electrical line. A first AC electronic switch such as a triac is coupled in series with the indicator in the second electrical line. The actuating gate of the first AC electronic switch is coupled to the first electrical line. The first AC electronic switch is therefore conducting and the indicator lamp on when there is electrical continuity through the load and power is being supplied to the load. A reactance control component is coupled in series with the load for adjusting the phase angle of gate current to voltage delivered to the gate terminal of the first AC electronic switch. The reactive component may be a second AC electronic switch coupled in series with the electrical load in the first electrical line.

Abstract: A heat exchange assembly for raising a process fluid, such as ultra-pure, de-ionized water, to an elevated temperature without adversely affecting the quality thereof includes coaxially-arranged inner and outer pipes, the annular space therebetween defining a flow passage for the fluid to be heated. The inner pipe is formed of high-strength metal of good thermal conductivity and encloses a heat source, such as steam, circulating heated fluid or an electric heater. The inner pipe is ensheathed by an extruded heat-shrinkable plastic tube of non-reactive material, such as PTFE or polypropylene not exceeding 7 mils in thickness, which is shrunk-fit thereon to form one wall of the flow passage. The opposing wall of the passage is formed by the interior surface of the outer pipe which is also constituted by non-reactive plastic material such as PTFE or polypropylene.

Abstract: Thermoelectric heat pumps using parallel flow, crossflow, or counter-flow of the input and output fluid streams have been designed and built, but performance has been insensitive to flow arrangement due to the use of one-piece, essentially isothermal heat exchangers on the heated and cooled thermoelectric junctions. Thus, none of these designs have capitalized on the sensitivity of the thermoelectric coefficient of performance to the junctions temperature differences and the smaller temperature differences possible with the counter-flow arrangement. In the improved design, the thermoelectric heat pump is broken down into discrete sections which heat or cool the input fluid in stages. The system thus operates as several discrete heat pumps each doing only a small portion of the heat pumping without sacrificing the desired final outlet temperature. Thus, the junction temperature differentials for each thermoelectric unit in the system is less than that with conventional one-piece heat sink designs.