Abstract: Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.

Abstract: Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer is employed proximate to the organic electronic device. Alternatively, a metal alloy sealant layer in combination with primer layer may also be implemented. Further, superstrates and edge wraps may be provided to completely surround the organic electronic device.

Abstract: An organic device package includes a flexible substrate having a topside and a bottom side. Further, the organic device package includes an organic electronic device having a first side and a second side disposed on the topside of the flexible substrate. In addition, the organic device package includes a first barrier layer disposed on the bottom side of the flexible substrate.

Abstract: Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer is employed proximate to the organic electronic device. Alternatively, a metal alloy sealant layer in combination with primer layer may also be implemented. Further, superstrates and edge wraps may be provided to completely surround the organic electronic device.

Abstract: Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect to on another are provided. The modules cathode of each organic light emitting module is electrically coupled to the anode of an adjacent light emitting module in an interconnect region. A portion of the cathode of each module extends adjacent to an active area of an adjacent module at an interconnect region. Methods of fabricating series groups of organic light emitting modules employing continuous material layers is also provided.

Abstract: The present invention relates to an area illumination light source comprising a plurality of individual OLED panels. The individual OLED panels are configured in a physically modular fashion. Each OLED panel comprising a plurality of OLED devices. Each OLED panel comprises a first electrode and a second electrode such that the power being supplied to each individual OLED panel may be varied independently. A power supply unit capable of delivering varying levels of voltage simultaneously to the first and second electrodes of each of the individual OLED panels is also provided. The area illumination light source also comprises a mount within which the OLED panels are arrayed.

Abstract: A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.

Abstract: Methods for adhering polyimide dielectric materials to copper-, titanium-, aluminum-, or copper-and-titanium-containing portions of a substrate are described. The methods include the steps of applying adhesion promoter to a clean surface of the substrate, and curing the adhesion promoter. SPIE varnish is applied over the cured adhesion promoter, and is itself cured. A further layer of adhesion promoter is applied over the cured SPIE varnish, and is cured. The polyimide dielectric material is then laminated to the adhesion promoter. Cleaning of the copper-containing substrate portions is performed by etching with etchant including cupric chloride, cleaning of the titanium-containing substrate portions is performed with etchant including HF, and cleaning of copper- and titanium-containing portions is performed by HF etching followed by cupric chloride etching. Aluminum-containing portions of the substrate are not etched.

Abstract: A light emitting device comprises a plurality of organic light emitting diode (OLED) modules. The OLED modules are arranged into a series group where the individual OLED modules are electrically connected in series. The device is configured to be coupled to a power supply. A display is also provided. The display includes a plurality of OLED modules arranged to depict a shape selected from the group consisting of at least one letter, at least one number, at least one image, and a combination thereof.

Abstract: Components or solid-state chips having electrical contacts containing copper are laminated to Kapton dielectric film, and through vias are formed down to copper-containing material of the component. A fabrication method is described for making reliable connections to the copper-containing materials. The method includes precoating the copper-containing material with SPIE, together with at least argon plasma cleaning, and possibly fluorine plasma etching, of the vias and copper material exposed at the bottoms of the vias.