Patents by Inventor William G. Eng

William G. Eng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer edge engineering method and device
    Patent number: 6265328
    Abstract: The present invention provides an apparatus (400) (500) for abating edge material from a substrate, e.g., SOI. The apparatus includes, among other elements, a housing and a rotatable member (401) coupled to the housing. The rotatable member is a susceptor, which is relatively flat for securing a substrate. A movable dispensing head (421) is coupled to the housing and is overlying the rotatable member. The movable dispensing head (421) is operable to emit a stream of directed fluid to one or more locations of the susceptor. The apparatus also includes a fluid source, which is coupled to the movable dispensing head. The fluid source provides fluid to ablate material from the substrate.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: July 24, 2001
    Assignee: Silicon Genesis Corporation
    Inventors: Francois J. Henley, Nathan Cheung, William G. Eng, Igor J. Malik