Abstract: An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board. The spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperature.

Abstract: A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.

Abstract: A bracket is disclosed for mounting one object on another. The bracket has two pivotally joined links, one for receiving said one object. Each link is pivotally joined to a respective fixing member for fixing to the other object. The pivotal joints have parallel pivotal axes so that the distance at which the fixing members are spaced, when fixed to the other object determines the angular orientation of said one object relative to the other.

Abstract: An electronic apparatus having a heat pipe that is thermally bonded to plates to internal and external enclosures. The electronic apparatus is located in a heat dissipative external enclosure. The electronic apparatus having at least one unit contained in a thermally conductive internal housing providing RF isolation and mounted on a wall of the external enclosure in thermal contact therewith. The electronic apparatus also having a heat pipe having a first plate bonded to its evaporator and a second plate bonded to its condenser, both bonds being thermally conductive. The first plate being mounted by fixings in thermal contact with the internal housing, the second plate being mounted by fixings in thermal contact with the wall of the external enclosure at a position lower, in use, than the first plate. This allows the heat pipe to be easily removed. This also allows the inner housing to maintain RF isolation.

Abstract: Electronic apparatus is contained in a heat dissipative external enclosure 2. The enclosure contains at least one unit contained in a thermally conductive internal housing 4,6 providing RF isolation and mounted on a wall 7 of the enclosure in thermal contact therewith. A wall 11 of the unit has a first recess 14 receiving the evaporator 13 of a heat pipe 12. The heat pipe is clamped between the external enclosure and the internal housing. The condenser 22 of the heat pipe is lower than the evaporator and is received by a recess 24 in the wall 7. The evaporator is clamped in the recess by a clamp member e.g. another unit 6.Because the heat pipe is clamped at its ends, it does not need to be an interference fit in either recess and may thus easily be removed. The inner housing can maintain RF isolation.

Abstract: An electronic apparatus is disclosed having components mounted within an environmentally sealed external enclosure. The external enclosure is cast from heat conductive material, and the components are mounted in heat conductive association with one or more walls of the external enclosure. These one or more walls have external pin fins projecting therefrom. The pin fins of the present invention improve cooling compared with conventional fins, which are, in effect, flat strips extending a significant distance along the surface of the external enclosure. Additionally, the external enclosure may be lighter in weight than an external enclosure that has conventional fins.

Abstract: Electronic apparatus is disclosed having components mounted within an environmentally sealed external enclosure. The external enclosure is made of heat conductive material and some of the components are mounted in heat conductive association with one or more walls of the external enclosure. The apparatus includes at least one heat pipe that has an evaporator in thermally conductive contact with a wall of the external enclosure proximate to one of the components. The condenser of the heat pipe is located outside the external enclosure and is provided with thermally conductive fins. Components that generate large amounts of heat can thus be provided with additional cooling reducing local hot spots. The external enclosure may be designed for the larger market in temperate climates, and be modified for hotter climates.

Abstract: A heater comprising a heating element embedded in a dielectric sheet, is disclosed. A leaf spring which is curved when relaxed, clamps the embedded heating element against a surface to be heated. The heater is optionally mounted on an internal surface of an enclosure. The heater is operable to a flux of about 3.9 kW-m.sup.2.

Abstract: An electronic apparatus having a heat dissipative external enclosure is disclosed. The external enclosure having a containment wall from which depend extended surfaces or fins having a length extending vertically and defining channels therebetween. The thickness of the enclosure between external surfaces of opposed containment walls varying between a relatively thin portion and a relatively thick portion to provide an interior space having a relatively narrow portion and a relatively wide portion to accommodate components or units of corresponding different extent. The fins having outer edges, spaced from the containment wall, and having plain first opposed surfaces adjacent their outer edges, the first surfaces including a first angle therebetween. The fins or parts of fins adjacent the relatively thin portion of the enclosure also having plain second opposed surfaces inwards of the first surfaces, the second surfaces including therebetween a second angle greater than the first angle.