Patents by Inventor William Gordon Walker

William Gordon Walker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit having a reduced spacing between a bus and adjacent circuitry
    Patent number: 6687880
    Abstract: An integrated circuit that reduces spacing between circuitry and a bus. In accordance with this invention, the bus is a strip of conductive material in a layer of the integrated circuit. The layer includes at least one slot that removes conductive material from the bus. The removal of the conductive material in the slot allows the space between circuitry adjacent the bus and the bus to be reduced.
    Type: Grant
    Filed: September 16, 2002
    Date of Patent: February 3, 2004
    Assignee: Virtual Silicon Technology, Inc.
    Inventors: Billie Jean Rivera, William Gordon Walker
  • Integrated circuit having a reduced spacing between a bus and adjacent circuitry
    Publication number: 20030061579
    Abstract: An integrated circuit that reduces spacing between circuitry and a bus. In accordance with this invention, the bus is a strip of conductive material in a layer of the integrated circuit. The layer includes at least one slot that removes conductive material from the bus. The removal of the conductive material in the slot allows the space between circuitry adjacent the bus and the bus to be reduced.
    Type: Application
    Filed: September 16, 2002
    Publication date: March 27, 2003
    Applicant: Virtual Silicon Technology, Inc. a Delaware Corporation
    Inventors: Billie Jean Rivera, William Gordon Walker
  • Integrated circuit having a reduced spacing between a bus and adjacent circuitry
    Patent number: RE40855
    Abstract: An integrated circuit that reduces spacing between circuitry and a bus. In accordance with this invention, the bus is a strip of conductive material in a layer of the integrated circuit. The layer includes at least one slot that removes conductive material from the bus. The removal of the conductive material in the slot allows the space between circuitry adjacent the bus and the bus to be reduced.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: July 14, 2009
    Inventors: Billie Jean Rivera, William Gordon Walker