Abstract: A method for fabricating a metal interconnection pattern for an integrated circuit module is provided comprising the steps of: aligning only one face of the module, forming a metal layer on at least one other face of the module, applying a coating of photoresist to the metal layer, exposing predetermined portions of the photoresist to reflected radiation, and shaping the metal layer in accordance with the exposed photoresist portions.

Abstract: A display system comprising a transparent display face, a frame detail surrounding the display face, a concealed hinge for internally hinging the display case to the frame detail, a concealed magnetic catch for securing the display face to the frame detail in a closed position, and a plurality of spaced apart compression springs mounted within the frame detail for pressing a sheet to be displayed flush against the display face at a plurality of pressure points.

Abstract: A contact assembly has a contact comprising two wire loops in an overlapping relationship, with a leg of each loop being interposed between the legs of the other loop. The prong forms the shank of a terminal pin, joined at an angle to a segment of the metal strip, which forms a tab portion of the pin. The contact is joined at one end of each loop leg to the tab portion, with the closed ends of the loops extending away from the tab/shank juncture. The closed ends of the loops are thus resiliently cantilevered from the pins to form a resilient, multi-wire contact.

Abstract: A method for manufacturing a contact assembly for an electronic component commences with providing (1) a length of wire formed into a continuous series of loops each having a pair of legs joined at a closed end, the series of loops comprising first and second pluralities of loops extending laterally in opposite directions from a longitudinal axis, each loop in one plurality axially located between the legs of a loop in the other plurality; and (2) a strip of metal having a plurality of prongs extending laterally from one side and spaced apart by the same distance as are the loops in the first plurality. The prongs are bent to form a slightly acute angle with the strip. The length of wire is attached to the strip so that each of the first plurality of loops extends into the space previously occupied by a prong before it was bent, the second plurality of loops extending outwardly from the opposite side of the strip.

Abstract: A socket for an integrated circuit device, particularly of the "Small Outline" type, includes a receptacle having a base and a pair of opposing side walls. A row of spaced-apart, generally vertical guide members extending inwardly from the interior surface of each side wall defines a row of generally vertical slots adjacent the interior surface of each side wall. Near the bottom of each slot is an electrical contact, comprising a pair of elongate, overlapping wire loops, each having a leg interposed between the legs of the other loop. The contact has one end conductively connected to an interior portion of a conductive pin which extends through the base of the receptacle. The other end of the contact is a free end that exhibits a resilient flexibility. A cover is provided with two opposed rows of downwardly-extending fingers, each of which is registrable with, and receivable in, one of the slots.

Abstract: This invention relates to a method for determining the minimum oil-film thickness of a lubricating oil composition under engine operating conditions using selected electrical capacitance means wherein a potential relating to the capacitance is developed across an electrically isolated bearing and crankshaft, said capacitance being converted through a derived formula to the minimum oil-film thickness at the particular time the potential is being applied.

Abstract: A wire of a normally nonforgeable composition, having improved resistance to fracture during working, handling and use is comprised of a portion with a rapidly quenched structure as a continuous stratum along its length. A preferred wire useful for fusion welding has a circular cross section with a microcrystalline surface portion of at least 30 volume percent of the wire. Other preferred wires have elliptical or rectangular cross sections with amorphous strata continuous along their lengths.

Abstract: Disclosed is an interlayer for brazing and diffusion bonding, having a portion as a continuous stratum with an amorphous structure. The amorphous stratum of the interlayer, being ductile, imparts structural integrity to the otherwise brittle alloy composition. Thus, forming and shaping of the interlayer to faying surfaces are improved. In the joining process, the interlayer melts, and on solidifying by cooling or interdiffusion of elements, is converted to a crystalline solid metallurgically bonded to the workpiece. Preferred are flat ribbons with a continuous amorphous surface stratum comprising at least 30 volume percent, and up to 100 percent, of the interlayer.

Abstract: A fushion welded surfacing process for use with crack prone substrates is described. The process involves the application of an intermediate layer of crack resistant alloy by fusion welding followed by the application of the desired final surfacing alloy by fusion welding. The intermediate layer is an age hardenable nickel superalloy to which intentional additions of manganese have been made. The final surfacing alloy may be of the hardfacing type or may be of a type which imparts corrosion and oxidation resistance to the underlying article.

Abstract: A class of age hardenable nickel base alloys for use as filler wires in fusion welding superalloys is described. The alloys contain manganese in levels of from about 0.5 to 3 percent to greatly reduce the incidence of heat-affected zone cracking in the metal being welded. The weld filler alloys also contain significant amounts of aluminum, titanium, tantalum, and columbium, and therefore the resultant welds can be age hardened to relatively high strength levels.

Abstract: Knocking sounds in an internal combustion engine are detected by a transducer, amplified, filtered to the knock frequencies, rectified and integrated to provide for each knock a DC pulse representative of the intensity of the knock. This DC pulse is fed to an up/down counter to step up the counter output voltage in proportion to the knock rate. After a delay the voltage in the counter is stepped down at a controlled rate by signals derived from the engine distributor. A net positive output of the up/down counter and knock intensity operate to proportionately retard the spark, which returns to its normal setting when the counter output is counted down to zero. Additionally an integrated knock signal is fed back to the signal amplifier to control amplifier gain as engine running noise varies. The time constants of the feedback circuit are sufficiently slow, and the amplifier gain control is inhibited by the presence of knock, such that amplifier gain is not modified by the short knock pulses.