Abstract: A method for forming a ball grid array to provide a chip carrier with I/O capabilities is described. The method includes combining three distinct steps into one: partitioning a solder sheet into identical solder pieces using a mask provided with openings that match the footprint of the chip carrier; reflowing the solder pieces into solder balls; and joining the balls to the I/O pads of the chip carrier. By combining these three steps into one, a high throughput, high volume, defect free and contamination free operation for forming I/O connections thus results.

Abstract: Multi-chip modules provided with a pin array may, under close scrutiny, display certain defects that may cause reliability problems. The presence of even one such defect necessitates the scrapping of the module. A method of salvaging the module is described, wherein the module is reworked by the method comprising the steps of applying a shearing force against the pins. During which the module is exposed to a temperature at or above that which is necessary for softening the braze material to remove the pins; polishing the surface of the module including the pads; evaporating the new pads; and attaching new pins to the pads.

Abstract: An ion milling end point detection method for etching coated substrates is disclosed comprising the use of a light measurement of light passing through a monitor substrate (e.g., glass coated with the same material at about the same thickness as the coated substrate to be etched) during the milling process, comparing the light values with a reference value and determining the end point of the milling process based on said values. Coated and uncoated monitor substrates may also be employed together and the values compared to determine the end point. An apparatus for determining the end point of an ion milling process is also disclosed.