Abstract: A lamp housing uses a tubular metal support functional as a heat radiator within which is an electrical circuit board having a component mounting surface, and in opposition thereto, a thermal transfer surface positioned for conducting heat, from the circuit board to the metal support. A clear lens is secured to the metal support, and a pair of ribs integral to the clear lens extend into contact with the component mounting surface of the circuit board thereby urging the thermal transfer surface toward the metal support for good thermal contact and heat transfer. A thermal transfer tape or paste may be used between the circuit board and the metal support surface upon which it rests. The circuit board may be laid onto the metal support without sliding it into grooves and the clear lens may be snapped into place over the circuit board engaging grooves in the metal support.

Abstract: A replacement for the standard fluorescent lamp tube has a plurality of LED devices mounted on a circuit board. The enclosure within which the circuit board is held has a clear or frosted lens mounted on a heat sink. The lens and heat sink each are arcuately shaped and together form a circular tube. A power converter is mounted below the circuit board and transfers its heat to the heat sink. A pair of pins mounted on the power converter extend beyond one end of the tube. An end cap has means for snapping onto and off the end of the tube and has clearance holes for the pins to protrude through and extend beyond so as to be fitting into mechanical and electrical contact with a standard lamp mounting fixture.

Abstract: A lamp housing uses a tubular metal support functional as a heat radiator within which is an electrical circuit board having a component mounting surface, and in opposition thereto, a thermal transfer surface positioned for conducting heat, from the circuit board to the metal support. A clear lens is secured to the metal support, and a pair of ribs integral to the clear lens extend into contact with the component mounting surface of the circuit board thereby urging the thermal transfer surface toward the metal support for good thermal contact and heat transfer. A thermal transfer tape or paste may be used between the circuit board and the metal support surface upon which it rests. The circuit board may be laid onto the metal support without sliding it into grooves and the clear lens may be snapped into place over the circuit board engaging grooves in the metal support.