Patents by Inventor William Hill Joseph
William Hill Joseph has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8516683Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: July 14, 2009Date of Patent: August 27, 2013Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Publication number: 20090271973Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: ApplicationFiled: July 14, 2009Publication date: November 5, 2009Inventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Patent number: 7559131Abstract: Methods of making a radio frequency identification (RFID) tag. A flexible strap is provided by disposing a plurality of RFID chips on a first web of flexible material and removing the flexible strap from the first web and attaching the flexible strap to an antenna on a flexible substrate.Type: GrantFiled: July 2, 2007Date of Patent: July 14, 2009Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Patent number: 7260882Abstract: Methods for making electronic devices with small functional elements supported on a carrier are presented. One method of making an electronic assembly is by first providing the following: a web of flexible material having a plurality of recesses, where each of the recesses containing an RFID chip, a flexible substrate having antennas, straps from the web by a web process, where each of the straps includes at least one RFID chip and a portion of the flexible material. The electronic assembly is formed by attaching the straps to the antennas so that each of the straps is coupled to one of the antennas and the density of the RFID chips on the web is higher than a density of the antennas on the flexible substrate. Other methods of making electronic devices with small functional elements supported on a carrier are disclosed.Type: GrantFiled: July 22, 2005Date of Patent: August 28, 2007Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Patent number: 6985361Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: September 27, 2004Date of Patent: January 10, 2006Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Patent number: 6816380Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: June 17, 2003Date of Patent: November 9, 2004Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Publication number: 20030214792Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: ApplicationFiled: June 17, 2003Publication date: November 20, 2003Inventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Patent number: 6606247Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: May 31, 2001Date of Patent: August 12, 2003Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
-
Publication number: 20020181208Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: ApplicationFiled: May 31, 2001Publication date: December 5, 2002Inventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph