Patents by Inventor William Izzicupo
William Izzicupo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10368461Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: GrantFiled: September 20, 2018Date of Patent: July 30, 2019Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
-
Publication number: 20190029139Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: ApplicationFiled: September 20, 2018Publication date: January 24, 2019Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
-
Patent number: 10111356Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: GrantFiled: March 31, 2016Date of Patent: October 23, 2018Assignee: Oracle International CorporationInventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
-
Publication number: 20170290190Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: ApplicationFiled: March 31, 2016Publication date: October 5, 2017Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
-
Patent number: 6927968Abstract: An enclosure to control access to a selected portion of an enclosed electronic device is provided. The enclosure includes a plurality of access panels that are capable of being fastened in a secure position via a single fastener mechanism. The fastener mechanism is operable by an authorized individual. The fastener mechanism controls when each of the plurality of faceplates can be disengaged from the enclosure to access a portion of the electronic device.Type: GrantFiled: October 31, 2002Date of Patent: August 9, 2005Assignee: Sun Microsystems, Inc.Inventors: Yvetta D. Pols Sandhu, Andrew P. Tosh, William A. Izzicupo
-
Publication number: 20040085713Abstract: An enclosure to control access to a selected portion of an enclosed electronic device is provided. The enclosure includes a plurality of access panels that are capable of being fastened in a secure position via a single fastener mechanism. The fastener mechanism is operable by an authorized individual. The fastener mechanism controls when each of the plurality of faceplates can be disengaged from the enclosure to access a portion of the electronic device.Type: ApplicationFiled: October 31, 2002Publication date: May 6, 2004Applicant: Sun Microsystems, Inc.Inventors: Yvetta D. Pols Sandhu, Andrew P. Tosh, William A. Izzicupo
-
Patent number: 6639807Abstract: A card retention mechanism securely holds a card within a slot on a circuit board. The retention mechanism may include a carrier and a retainer. The carrier mounts to a chassis of the computer system adjacent to the card slot. The retainer may be pivotally mounted to the carrier. When the retainer is in a closed position, at least one surface of the retainer engages an endplate of the card, and the retainer engages the carrier. The engagement of the retainer and the carrier inhibits rotation of the retainer from the closed position to an open position. When the retainer is in the closed position, the retainer securely holds the card to the chassis of the computer system.Type: GrantFiled: April 10, 2000Date of Patent: October 28, 2003Assignee: Sun Microsoft, Inc.Inventors: James M. Carney, William A. Izzicupo, Robert S. Antonuccio, Timothy M. Holland
-
Publication number: 20020140147Abstract: A test stand for testing computer hardware components is provided. The test stand has a base structure. A first support arm mounts to the base structure. The first support arm has one or more apertures disposed therein to enable airflow through the support arm to avoid airflow hindrance of cooling fans during operation of the subject internal computer hardware components and when the test stand is in certain positions. A second support arm also mounts to the base structure. The second support arm has a rotation mechanism mounted therein. A support bracket for supporting the test subject computer hardware components extends between the first support arm and the second support arm. The support bracket is in communication with the rotation mechanism, such that the rotation mechanism controls and enables the rotation of the support bracket through a predetermined rotational degree range.Type: ApplicationFiled: March 27, 2001Publication date: October 3, 2002Applicant: Sun Microsystems, Inc.Inventors: Yvetta D. Pols Sandhu, William A. Izzicupo, Ronald R. Boudreau
-
Patent number: 6437992Abstract: An insulating guard is mounted over a backplane or motherboard in an electronic system that accepts hot pluggable circuit cards. The insulating guard has openings that expose only the connectors and allow a hot pluggable circuit card to be inserted without the possibility of shorting the backplane. In order to prevent contact between a card being inserted and adjacent cards that have already been connected to the system, the invention provides for insulating card dividers which are connected to the insulating guard and fit between adjacent cards. The card dividers can be attached to the insulating guard by parts which snap together, fasteners or adhesives.Type: GrantFiled: December 21, 1999Date of Patent: August 20, 2002Assignee: Sun Microsystems, Inc.Inventors: James M. Carney, William A. Izzicupo, Robert S. Antonuccio, Timothy M. Holland
-
Patent number: 6239592Abstract: A test fixture which holds multiple circuit boards in an edge-to-edge configuration for testing includes a sliding interconnect mechanism which is located between the circuit boards under test. The interconnect mechanism includes an interconnect board on which are mounted pairs of inter-wired frame connectors which mate with the connectors on each of the printed circuit boards to be tested and electrically interconnect the boards. The interconnect mechanism includes guide pins on which the interconnect mechanism slides to accurately align the frame and board connectors and an actuating mechanism to move the interconnect mechanism into position to securely mate the aligned connectors. The actuating mechanism can also be reversed to unmate the connectors and release the boards under test after the tests are completed.Type: GrantFiled: June 2, 1999Date of Patent: May 29, 2001Assignee: Sun Microsystems, Inc.Inventors: James M. Carney, Yvetta D. Pols, Robert S. Antonuccio, Joseph M. Spano, William A. Izzicupo, Timothy M. Holland, Lewis B. Sheen, III, Joseph J. Montagna, Daniel D. Gonsalves
-
Patent number: 6141213Abstract: The invention relates to a computer system and method thereof characterized by high airflow and low acoustic noise by separating the enclosure of the system into two sections, in which in one section cooling fans are arranged between power supply units and disk drives, the power supply units being located at the back of the section and the fans, as to the disk drives, serving as exhaust fans, and in the other section inlet fans are arranged to cool selected hardware electrical elements, such as CPU modules, PCI and graphics cards, wherein the placement of the inlet fans is selected to minimize pre-heated air and fan airflow paths are controlled and directed by an air dam to maximize the cooling effect, and noise damping material is employed in mounting the rack for the disk drives, the disk drives and fans and in forming the side walls of the enclosure.Type: GrantFiled: June 24, 1997Date of Patent: October 31, 2000Assignee: Sun Microsystems, Inc.Inventors: Robert S. Antonuccio, Thomas E. Stewart, Joseph M. Spano, Mathew J. Palazola, William A. Izzicupo, James M. Carney, Daniel D. Gonsalves, Mark R. Pugliese
-
Patent number: 5957465Abstract: A PCI card is inserted through an I/O opening in a computer panel. On one edge of the card is a cover from one end of which projects a tab. A resilient gasket is attached to the panel to create a flexible EMC seal around the opening. Preferably the gasket is formed of tin-plated beryllium copper. The gasket has alternate staggered spring fingers oriented opposite to the direction of insertion of the PCI card. To retain the gasket the panel is formed with slots at either end and an outward struck projection at the middle. The gasket is formed with a tongue at either end to be inserted in one of the slots and a punched-out opening to receive the projection.Type: GrantFiled: June 17, 1997Date of Patent: September 28, 1999Assignee: Sun Microsystems, Inc.Inventors: Daniel Derrick Gonsalves, Kenneth Kitlas, Robert Antonnucio, William Izzicupo, James Carney, Mark Pugliese, Joseph Spano, Mathew Palazola, David Desilets
-
Patent number: 5927389Abstract: A computer housing or electronic apparatus frame (10) includes a compartment (12) that provides space for mounting a fan assembly (14) or similar component. The fan assembly (14) is mounted on a fan tray support (16), which is removably mountable within the computer housing (10) by means of the fan tray mounts (18). Fan tray mounts (18) are oriented facing one another so that side rails (22) of fan tray (16) are slidably received by the fan tray mounts (18). The fan tray mounts (18) further includes an elongated guide channel (31) that extends the length of the fan tray mount and is formed in the inside face (30) thereof. The fan tray mounts (18) also include a first, outwardly projecting stop (52) that is positioned inwardly from end wall (38) and a second, outwardly-projecting, resiliently-deflectable stop and latch lever (54) provided adjacent end wall (36).Type: GrantFiled: June 20, 1997Date of Patent: July 27, 1999Assignee: Sun Microsystems, Inc.Inventors: Daniel D. Gonsalves, Robert Antonuccio, William Izzicupo, James Carney, Mark Pugliese, Joseph Spano, Matthew Palazola, David Desilets
-
Patent number: 5911596Abstract: An apparatus for securing a conductor to a circuit board. The conductor is configured for being soldered to the circuit board through a first aperture in the board. The apparatus includes a conductor supporting portion having a second aperture therethrough. The conductor supporting portion is configured for coupling to the circuit board. The second aperture substantially aligns with the first aperture when the conductor supporting portion is coupled to the circuit board to permit the conductor to be inserted through both the first aperture and the second aperture. The apparatus includes a tab portion configured for coupling to the conductor supporting portion. A portion of the conductor is thus held substantially immobile between the conductor supporting portion and a first edge of the tab portion when the tab portion is coupled with the conductor supporting portion, thereby preventing the conductor from being broken at the portion of the conductor when the conductor is flexed.Type: GrantFiled: February 4, 1997Date of Patent: June 15, 1999Assignee: Sun Microsystems, Inc.Inventors: Robert S. Antonuccio, David E. Desilets, Joseph M. Spano, Mathew J. Palazola, William A. Izzicupo, James M. Carney, Daniel D. Gonsalves, Mark R. Pugliese
-
Patent number: 5839584Abstract: A structural foam, injection molded superstructure is attached to a motherboard by means of threaded inserts. The superstructure is formed with guide ways for CPU processor modules, and also for the edges of PCI cards. Features of the structure include cam levers on the CPU modules to install and extract the modules. A metal transverse vertical retaining bracket is attached to the superstructure to hold sides thereof parallel and prevent splaying of the free, open end of the superstructure upon extraction of CPU processor modules. The assembly provides stiffness to the motherboard.Type: GrantFiled: June 9, 1997Date of Patent: November 24, 1998Assignee: Sun Microsystems, Inc.Inventors: Daniel Derrick Gonsalves, Robert Antonnucio, William Izzicupo, James Carney, Mark Pugliese, Joseph Spano, Mathew Palazola, David Desilets
-
Patent number: 5579212Abstract: There is disclosed a cover for protecting the leads extending between a silicon chip device and an associated printed circuit board and their electrical connections with the board. The cover is formed out of clear plastic allowing inspection of the chip device and has several legs for securing and maintaining the cover on the board and has openings that allow for cooling of the chip device.Type: GrantFiled: March 22, 1995Date of Patent: November 26, 1996Assignee: Sun Microsystems, Inc.Inventors: Daniel Albano, Robert S. Antonuccio, William A. Izzicupo, Mario N. Palmeri, Jr.
-
Patent number: 5400214Abstract: In a computer system requiring the CPU board to be installed and removed from the top of the chassis, there is included a CPU board installation and maintaining lever supported for movement from the base of the chassis and perpendicularly to the board when the board is installed. The board has an opening of a dimension to allow the board on installation and removal to passed over the lever into a position where contact with the lever will move the board into and out of its operative position without the need to use hardware on its installation and removal. Also included is a bracket having holding surfaces securing a speaker to the bracket and the bracket to the chassis, the latter holding surfaces allowing the bracket to assume a first position in the chassis and a second position away from the base of the chassis to create a suitable space for the installation and removal of the board to and from the chassis.Type: GrantFiled: November 6, 1992Date of Patent: March 21, 1995Assignee: Sun Microsystems, Inc.Inventors: Robert S. Antonuccio, William A. Izzicupo
-
Patent number: 5139430Abstract: A mechanical insertion/ejection lever device is provided for use in mounting a printed circuit board (PCB) into an electrical receptacle secured to a housing. Two lever members are pivotally mounted at or near the rear edge of a PCB, adjacent the corners. As the PCB is manually inserted into the housing unit, the lever members engage part of the housing. Rotation of the lever members causes a proportional linear motion of the PCB into engagement of the receptacle, overcoming frictional resistance of the electrical connectors. The lever members are rotatable through an arc of motion which corresponds to moving the PCB a linear distance sufficient to compensate for all accumulated manufacturing tolerances while fully seating the PCB within the receptacle. The lever members adjustably lock to retain the PCB in a fully seated position. The lever members also eject the PCB from the receptacle upon rotation in an opposite direction.Type: GrantFiled: June 28, 1990Date of Patent: August 18, 1992Assignee: Digital Equipment CorporationInventors: Jeffrey M. Lewis, Rae-Ann S. Locicero, William A. Izzicupo
-
Patent number: D342236Type: GrantFiled: August 13, 1991Date of Patent: December 14, 1993Assignee: Sun Microsystems, Inc.Inventors: Dan Albano, Dave Desilets, William Izzicupo, Steve Peart
-
Patent number: D425495Type: GrantFiled: March 30, 1998Date of Patent: May 23, 2000Inventors: Christopher E. Chiodo, William A. Izzicupo, Jonathan A. Colprit, Mathew J. Palazola, Herbert F. H. Pfeifer, Paul S. Montgomery