Patents by Inventor William J. E. Parr

William J. E. Parr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive metal-filled substrates via developing agents
    Patent number: 5252255
    Abstract: A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: October 12, 1993
    Assignee: Akzo America Inc.
    Inventors: Paul Y. Y. Moy, William J. E. Parr, Dieter Frank, Ronald E. Hutton
  • Conductive metal-filled composites via developing agents
    Patent number: 5173519
    Abstract: A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: January 7, 1991
    Date of Patent: December 22, 1992
    Assignee: Akzo N.V.
    Inventors: Paul Y. Y. Moy, William J. E. Parr, Dieter Frank, Ronald Hutton
  • Method of making conductive metal-filled substrates without developing agents
    Patent number: 5049332
    Abstract: A conductive-metal-filled substrate is formed by intermingling oxide coated, non-conductive copper or nickel particles into a substrate having a softening point of at least 200.degree. C. followed by compression molding at a temperature of at least 200.degree. C. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: July 3, 1990
    Date of Patent: September 17, 1991
    Assignee: Akzo NV
    Inventors: Karolyn E. Ziemer, William J. E. Parr
  • Conductive metallization of substrates via developing agents
    Patent number: 4997674
    Abstract: A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.
    Type: Grant
    Filed: June 6, 1988
    Date of Patent: March 5, 1991
    Assignee: Akzo America Inc.
    Inventors: William J. E. Parr, Ronald E. Hutton, Paul Y. Y. Moy, Dieter Frank, David A. Strawser
  • Conductive metal-filled substrates via developing agents
    Patent number: 4961879
    Abstract: A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
    Type: Grant
    Filed: June 8, 1988
    Date of Patent: October 9, 1990
    Assignee: Akzo America Inc.
    Inventors: Paul Y. Y. Moy, William J. E. Parr, Dieter Frank, Ronald E. Hutton