Patents by Inventor William J. Tilly

William J. Tilly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps
    Patent number: 5277749
    Abstract: A layer of photoresist provides a stress relief (or cushion) layer between a lift-off polymer layer and a barrier of multi-level lift-off structures. When multiple evaporation steps are required using the same lift-off pattern, the adhesion between organosilicon and organic film is stressed by a first blanked metal film. To prevent delamination between the lift-off polymer layer and RIE barrier photoresist is applied on top of the lift-off polymer and sandwiched between the organosilicon and organic materials. This photoresist acts as a cushion and as an adhesion promoter to reduce delamination after the metal deposition(s).
    Type: Grant
    Filed: October 17, 1991
    Date of Patent: January 11, 1994
    Assignee: International Business Machines Corporation
    Inventors: Jonathan H. Griffith, John I. Kim, Thomas L. Leong, William J. Tilly, Sari Wacks