Abstract: Disclosed herein is an improved electronic device enclosure and methods for manufacturing the same. One embodiment includes a front panel; a back panel with a patterned intrusion region to improve passive audio amplification; an electrically conductive front plate; an electrically conductive back plate with an open region configured to permit transmission of radiofrequency signals; wherein the front plate couples with the front panel, the back plate couples with the back panel, the front panel hingedly couples with the back panel, and the front plate and back plate are configured to enclose an electronic device; and the front plate is sized and dimensioned to block radiofrequency radiation from exiting the front panel of the electronic device enclosure.

Abstract: Embodiments of the inventive subject matter are directed to gaskets that can be used in various extreme settings including high temperature, vacuum, and high-pressure settings. Gaskets are made using soft annealed metals including aluminum, copper, nickel, and steel. Upon fully tightening a fitting using a gasket of the inventive subject matter, the gasket’s material is brought into a full hardness condition from its original soft annealed state. Ports that are designed for use with gaskets of the inventive subject matter is also disclosed. These ports include a first hole having a first diameter and then a second hole that continues from the first, where the second hole has a second, smaller diameter. Material transitions from the first diameter to the second diameter by a radial fillet. The filleted surface is configured to interact with a gasket of the inventive subject matter to minimize leak pathways.

Abstract: Disclosed herein is an improved electronic device enclosure and methods for manufacturing the same. One embodiment includes a front panel; a back panel with a patterned intrusion region to improve passive audio amplification; an electrically conductive front plate; an electrically conductive back plate with an open region configured to permit transmission of radiofrequency signals; wherein the front plate couples with the front panel, the back plate couples with the back panel, the front panel hingedly couples with the back panel, and the front plate and back plate are configured to enclose an electronic device; and the front plate is sized and dimensioned to block radiofrequency radiation from exiting the front panel of the electronic device enclosure.

Abstract: Disclosed herein is an improved electronic device enclosure and methods for manufacturing the same. One embodiment includes a front panel; a back panel with a patterned intrusion region to improve passive audio amplification; an electrically conductive front plate; an electrically conductive back plate with an open region configured to permit transmission of radiofrequency signals; wherein the front plate couples with the front panel, the back plate couples with the back panel, the front panel hingedly couples with the back panel, and the front plate and back plate are configured to enclose an electronic device; and the front plate is sized and dimensioned to block radiofrequency radiation from exiting the front panel of the electronic device enclosure.

Abstract: Disclosed herein is an improved electronic device enclosure and methods for manufacturing the same. One embodiment includes a front panel; a back panel with a patterned intrusion region to improve passive audio amplification; an electrically conductive front plate; an electrically conductive back plate with an open region configured to permit transmission of radiofrequency signals; wherein the front plate couples with the front panel, the back plate couples with the back panel, the front panel hingedly couples with the back panel, and the front plate and back plate are configured to enclose an electronic device; and the front plate is sized and dimensioned to block radiofrequency radiation from exiting the front panel of the electronic device enclosure.