Patents by Inventor William K. McDonald

William K. McDonald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5454163
    Abstract: A method of making a porous plug suitable for use as a phase separator, heat exchanger tube, wherein very small uniform holes are produced in a matrix by placing a first material in a matrix of a second material to form a bundle or billet comprising said materials, reducing the cross-section of the bundle or billet by drawing or extrusion to form a reduced cross-section rod, and then etching away one of the materials to leave a matrix with very small uniform holes therein. The reduced rod may be bundled with other similarly reduced rods to form a bundle which is again drawn to further reduce the cross-section thereof.
    Type: Grant
    Filed: September 16, 1993
    Date of Patent: October 3, 1995
    Inventors: William K. McDonald, Philip M. O'Larey
  • Patent number: 5195017
    Abstract: A first polysilicon layer (18) is initially deposited onto a layer of field oxide (16). A dielectric (26) is formed on a portion of the first polysilicon layer (18). A second polysilicon layer (28) is deposited over the dielectric (26) and the first polysilicon layer (18). After the selective deposition of a mask (30) on to the second polysilicon layer (28), the polysilicon layers (18, 28) are anistropically etched to form a polysilicon to polysilicon capacitor (34) and a contact (36) of the capacitor (34). The dielectric (26) functions as an insulator for the capacitor (34) and as a barrier during anisotropic etching for protecting the underlying polysilicon layer (18).
    Type: Grant
    Filed: December 16, 1991
    Date of Patent: March 16, 1993
    Assignee: Texas Instruments Incorporated
    Inventor: William K. McDonald
  • Patent number: 5037772
    Abstract: A first polysilicon layer (18) is initially deposited onto a layer of field oxide (16). A dielectric (26) is formed on a portion of the first polysilicon layer (18). A second polysilicon layer (28) is deposited over the dielectric (26) and the first polysilicon layer (18). After the selective deposition of a mask (30) on to the second polysilicon layer (28), the polysilicon layers (18, 28) are anistropically etched to form a polysilicon to polysilicon capacitor (34) and a contact (36) of the capacitor (34). The dielectric (26) functions as an insulator for the capacitor (34) and as a barrier during anisotropic etching for protecting the underlying polysilicon layer (18).
    Type: Grant
    Filed: December 13, 1989
    Date of Patent: August 6, 1991
    Assignee: Texas Instruments Incorporated
    Inventor: William K. McDonald
  • Patent number: 4414428
    Abstract: A wire filament or multifilament wire or cable having an expanded metal or foraminous metal concentrically or semiconcentrically layered along the length of the wire so that the spaces or holes in the metal open radially of the wire or filament. The expanded or foraminous metal can be used in said wires or filaments as a strengthening layer, a conducting layer, or a diffusion barrier layer.
    Type: Grant
    Filed: January 30, 1981
    Date of Patent: November 8, 1983
    Assignee: Teledyne Industries, Inc.
    Inventor: William K. McDonald
  • Patent number: 4262412
    Abstract: A method of producing composite rod or wire of increased strength and fineness wherein the composite is formed by reducing a lamina of two metals which have been rolled to form a cylindrical billet wherein one of the metals is in expanded form. The composite produced can be encased in copper and fabricated to produce a superconductor. Alloys contemplated for producing superconductors are Nb.sub.3 Sn, Nb.sub.3 Ga, Nb.sub.3 Ge, Nb.sub.3 Si, Nb-Ti, V.sub.3 Ga, V.sub.3 Si, V.sub.3 Sn, V.sub.3 Al, and V.sub.3 Ge laminated on bronze, Al, Cu, Ta, or combinations thereof.
    Type: Grant
    Filed: May 29, 1979
    Date of Patent: April 21, 1981
    Assignee: Teledyne Industries, Inc.
    Inventor: William K. McDonald