Abstract: An integrated circuit includes a circuit area, and first and second scribe line portions. The first scribe line portion borders a first side of the circuit area, and the second scribe line portion borders a different second side of the circuit area. A plurality of dummy metal structures are located in the first and second scribe line portions, each of the dummy metal structures being located about at a lattice point of a same two-dimensional grid.

Abstract: In examples, a method of manufacturing an integrated circuit comprises locating a photomask between a light source and a semiconductor wafer having a photoresist layer in a wafer scribe lane of the wafer, wherein the photomask comprises: a first mask scribe lane pattern; a second mask scribe lane pattern matching the first mask scribe lane pattern; and at least one circuit pattern of the integrated circuit located between the first and second mask scribe lane patterns. The method further includes illuminating the photomask to produce in the photoresist layer of the wafer scribe lane a first exposed portion corresponding to the second mask scribe lane pattern; locating the first mask scribe lane pattern between the light source and the first exposed portion; and illuminating the photomask, wherein the first mask scribe lane pattern substantially shields non-exposed portions of the photoresist layer of the wafer scribe lane from light exposure.

Abstract: In examples, a method of manufacturing an integrated circuit comprises locating a photomask between a light source and a semiconductor wafer having a photoresist layer in a wafer scribe lane of the wafer, wherein the photomask comprises: a first mask scribe lane pattern; a second mask scribe lane pattern matching the first mask scribe lane pattern; and at least one circuit pattern of the integrated circuit located between the first and second mask scribe lane patterns. The method further includes illuminating the photomask to produce in the photoresist layer of the wafer scribe lane a first exposed portion corresponding to the second mask scribe lane pattern; locating the first mask scribe lane pattern between the light source and the first exposed portion; and illuminating the photomask, wherein the first mask scribe lane pattern substantially shields non-exposed portions of the photoresist layer of the wafer scribe lane from light exposure.

Abstract: A purge control valve control system is provided for an internal combustion engine system, comprising: a voltage source having a positive potential and a negative potential; a purge control valve having a solenoid, such solenoid comprising an electrically inductive element, such inductive element having a first terminal coupled to the positive potential of the voltage source; a diode having an anode and a cathode. The control unit includes a transistor having: a control electrode fed by a train of pulses; a first electrode coupled to the negative potential of the voltage source; and a second electrode coupled to a second terminal of the inductive element and to the diode.

Abstract: An evaporative emission control canister for an automotive vehicle includes a canister body and a bracket for attaching the body to a structural member of a vehicle. A number of fastener sets attach the bracket to the canister body, with each of the fastener sets including a closed-end hollow core boss having a generally cylindrical wall of uniform thickness and a number of buttresses applied to an outer surface of the generally cylindrical wall. The buttresses have the same uniform thickness as the generally cylindrical wall and are molded along with the cylindrical wall as one piece with an inner portion of the canister body.

Abstract: An evaporative emission control canister for an automotive vehicle includes a canister body and a bracket for attaching the body to a structural member of a vehicle. A number of fastener sets attach the bracket to the canister body, with each of the fastener sets including a closed-end hollow core boss having a generally cylindrical wall of uniform thickness and a number of buttresses applied to an outer surface of the generally cylindrical wall. The buttresses have the same uniform thickness as the generally cylindrical wall and are molded along with the cylindrical wall as one piece with an inner portion of the canister body.