Patents by Inventor William Kuang
William Kuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11495932Abstract: Embodiments of a slip ring for use in a rotatable substrate support are provided herein. In some embodiments a slip ring includes a main body having a top wall, a bottom wall, and a sidewall extending between the top and bottom walls, wherein the top wall, bottom wall, and sidewall define an inner volume within the main body, wherein a central opening is formed through the top wall; a plurality of annular containers disposed within the inner volume and coaxially with the main body, wherein the plurality of annular containers are vertically spaced apart from one another, and wherein each of the plurality of annular containers contains a first volume of an electrically conductive liquid; an upper cylindrical body rotatably disposed in the central opening; a lower cylindrical body fixedly coupled to the lower wall of the main body.Type: GrantFiled: June 6, 2018Date of Patent: November 8, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Muhannad Mustafa, Yu Chang, William Kuang, Muhammad M. Rasheed, Xiping Huo
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Patent number: 10704142Abstract: Embodiments of the present disclosure are directed to a quick disconnect resistance temperature detector (RTD) heater assembly, that includes a first assembly comprising a pedestal, a pedestal shaft, an adapter, one or more heater power supply terminals, and at least one RTD, and a second assembly comprising a rotating module having a central opening, and a cable assembly partially disposed in the central opening and securely fastened to the rotating module, wherein the first assembly is removably coupled to the second assembly, wherein the cable assembly includes one or more power supply sockets that receive the heater power supply terminals when the first and second assemblies are coupled together, and wherein the cable assembly includes one or more spring loaded RTD pins that contact the at least one RTD disposed in the first assembly when the first and second assemblies are coupled together.Type: GrantFiled: July 27, 2017Date of Patent: July 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Muhannad Mustafa, Muhammad M. Rasheed, Mario Dan Sanchez, Yu Chang, William Kuang, Vinod Konda Purathe, Manjunatha Koppa
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Publication number: 20190032210Abstract: Embodiments of the present disclosure are directed to a quick disconnect resistance temperature detector (RTD) heater assembly, that includes a first assembly comprising a pedestal, a pedestal shaft, an adapter, one or more heater power supply terminals, and at least one RTD, and a second assembly comprising a rotating module having a central opening, and a cable assembly partially disposed in the central opening and securely fastened to the rotating module, wherein the first assembly is removably coupled to the second assembly, wherein the cable assembly includes one or more power supply sockets that receive the heater power supply terminals when the first and second assemblies are coupled together, and wherein the cable assembly includes one or more spring loaded RTD pins that contact the at least one RTD disposed in the first assembly when the first and second assemblies are coupled together.Type: ApplicationFiled: July 27, 2017Publication date: January 31, 2019Inventors: Muhannad MUSTAFA, Muhammad M. RASHEED, Mario Dan SANCHEZ, Yu CHANG, William Kuang, Vinod Konda PURATHE, Manjunatha KOPPA
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Publication number: 20180358768Abstract: Embodiments of a slip ring for use in a rotatable substrate support are provided herein. In some embodiments a slip ring includes a main body having a top wall, a bottom wall, and a sidewall extending between the top and bottom walls, wherein the top wall, bottom wall, and sidewall define an inner volume within the main body, wherein a central opening is formed through the top wall; a plurality of annular containers disposed within the inner volume and coaxially with the main body, wherein the plurality of annular containers are vertically spaced apart from one another, and wherein each of the plurality of annular containers contains a first volume of an electrically conductive liquid; an upper cylindrical body rotatably disposed in the central opening; a lower cylindrical body fixedly coupled to the lower wall of the main body.Type: ApplicationFiled: June 6, 2018Publication date: December 13, 2018Inventors: Muhannad Mustafa, Yu Chang, William Kuang, Muhammad M. Rasheed, Xiping Huo
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Patent number: 9202674Abstract: A bridge assembly includes an electrically insulating hollow tube or bridge having a pair of ends, the bridge being supported at one of the ends over the cylindrical side wall and being supported at the other of the ends over the electrode. The bridge assembly further includes a set of conductive rings surrounding the hollow tube and spaced from one another along the length of the bridge, and plural electrically resistive elements. Each of the resistive elements has a pair of flexible connectors, respective ones the resistive elements connected at their flexible connectors between respective pairs of the rings to form a series resistor assembly.Type: GrantFiled: October 21, 2008Date of Patent: December 1, 2015Assignee: APPLIED MATERIALS, INC.Inventors: Olkan Cuvalci, Yu Chang, William Kuang, Anqing Cui, Seshadri Ganguli
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Patent number: 8721847Abstract: A control system and method for controlling two motors determining the azimuthal and circumferential position of a magnetron rotating about the central axis of the sputter chamber in back of its target sputtering and capable of a nearly arbitrary scan path, e.g., with a planetary gear mechanism. A system controller periodically sends commands to the motion controller which closely controls the motors. Each command includes a command ticket, which may be one of several values. The motion controller accepts only commands having a command ticket of a different value from the immediately preceding command. One command selects a scan profile stored in the motion controller, which calculates motor signals from the selected profile. Another command instructs a dynamic homing command which interrogates sensors of the position of two rotating arms to determine if the arms in the expected positions. If not, the arms are rehomed.Type: GrantFiled: January 10, 2012Date of Patent: May 13, 2014Assignee: Applied Materials, Inc.Inventors: Yu Chang, William Kuang, Ronald D. DeDore, Jitendra R. Bhimjiyani, Wesley W. Zhang
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Publication number: 20120103800Abstract: A control system and method for controlling two motors determining the azimuthal and circumferential position of a magnetron rotating about the central axis of the sputter chamber in back of its target sputtering and capable of a nearly arbitrary scan path, e.g., with a planetary gear mechanism. A system controller periodically sends commands to the motion controller which closely controls the motors. Each command includes a command ticket, which may be one of several values. The motion controller accepts only commands having a command ticket of a different value from the immediately preceding command. One command selects a scan profile stored in the motion controller, which calculates motor signals from the selected profile. Another command instructs a dynamic homing command which interrogates sensors of the position of two rotating arms to determine if the arms in the expected positions. If not, the arms are rehomed.Type: ApplicationFiled: January 10, 2012Publication date: May 3, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Yu Chang, William Kuang, Ronald D. DeDore, Jitendra R. Bhimjiyani, Wesley W. Zhang
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Patent number: 8114256Abstract: A control system and method for controlling two motors determining the azimuthal and circumferential position of a magnetron rotating about the central axis of the sputter chamber in back of its target sputtering and capable of a nearly arbitrary scan path, e.g., with a planetary gear mechanism. A system controller periodically sends commands to the motion controller which closely controls the motors. Each command includes a command ticket, which may be one of several values. The motion controller accepts only commands having a command ticket of a different value from the immediately preceding command. One command selects a scan profile stored in the motion controller, which calculates motor signals from the selected profile. Another command instructs a dynamic homing command which interrogates sensors of the position of two rotating arms to determine if the arms in the expected positions. If not, the arms are rehomed.Type: GrantFiled: November 30, 2007Date of Patent: February 14, 2012Assignee: Applied Materials, Inc.Inventors: Yu Chang, William Kuang, Ronald D Dedore, Jitendra R. Bhimjiyani, Wesley W Zhang
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Patent number: 7910853Abstract: A method and apparatus for controlling power output of a capacitatively-coupled plasma are provided. A detector is disposed on the power delivery conduit carrying power to one electrode to detect fluctuations in power output to the electrode. The detector is coupled to a signal generator, which converts the RF input signal to a constant control signal. A controller adjusts power input to the RF generator by comparing the control signal to a reference.Type: GrantFiled: February 28, 2008Date of Patent: March 22, 2011Assignee: Applied Materials, IncInventors: David T. Or, Yu Chang, William Kuang, Joel M. Huston, Chien-Teh Kao, Mei Chang
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Patent number: 7867806Abstract: An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.Type: GrantFiled: May 22, 2007Date of Patent: January 11, 2011Assignee: Flextronics AP, LLCInventors: Bhret Graydon, William Kuang-Hue Shu
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Patent number: 7782629Abstract: A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is approximately the same as the diameter of the cylindrical component. The hole is similar to a via in a printed circuit board, except that the hole is not plated through (such would cause an electrical short). Electrically conductive lines are provided to the openings of the hole on the upper and the lower surfaces of the PCB. The area of the exposed end of the cylindrical component and the termination of the conducting line is less than the area of a surface mounted component equivalent to the cylindrical component.Type: GrantFiled: July 25, 2007Date of Patent: August 24, 2010Assignee: Flextronics AP, LLCInventors: Bhret Graydon, William Kuang-Hua Shu
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Publication number: 20100096085Abstract: A bridge assembly includes an electrically insulating hollow tube or bridge having a pair of ends, the bridge being supported at one of the ends over the cylindrical side wall and being supported at the other of the ends over the electrode. The bridge assembly further includes a set of conductive rings surrounding the hollow tube and spaced from one another along the length of the bridge, and plural electrically resistive elements. Each of the resistive elements has a pair of flexible connectors, respective ones the resistive elements connected at their flexible connectors between respective pairs of the rings to form a series resistor assembly.Type: ApplicationFiled: October 21, 2008Publication date: April 22, 2010Applicant: Applied Materials, Inc.Inventors: OLKAN CUVALCI, Yu Chang, William Kuang, Anqing Cui, Seshadri Ganguli
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Publication number: 20090218324Abstract: A method and apparatus for controlling power output of a capacitatively-coupled plasma are provided. A detector is disposed on the power delivery conduit carrying power to one electrode to detect fluctuations in power output to the electrode. The detector is coupled to a signal generator, which converts the RF input signal to a constant control signal. A controller adjusts power input to the RF generator by comparing the control signal to a reference.Type: ApplicationFiled: February 28, 2008Publication date: September 3, 2009Inventors: David T. Or, Yu Chang, William Kuang, Joel M. Huston, Chien-Teh Kao, Mei Chang
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Publication number: 20090139854Abstract: A control system and method for controlling two motors determining the azimuthal and circumferential position of a magnetron rotating about the central axis of the sputter chamber in back of its target sputtering and capable of a nearly arbitrary scan path, e.g., with a planetary gear mechanism. A system controller periodically sends commands to the motion controller which closely controls the motors. Each command includes a command ticket, which may be one of several values. The motion controller accepts only commands having a command ticket of a different value from the immediately preceding command. One command selects a scan profile stored in the motion controller, which calculates motor signals from the selected profile. Another command instructs a dynamic homing command which interrogates sensors of the position of two rotating arms to determine if the arms in the expected positions. If not, the arms are rehomed.Type: ApplicationFiled: November 30, 2007Publication date: June 4, 2009Applicant: Applied Materials, Inc.Inventors: Yu Chang, William Kuang, Ronald D. Dedore, Jitendra R. Bhimjiyani, Wesley W. Zhang
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Publication number: 20080206927Abstract: An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.Type: ApplicationFiled: May 22, 2007Publication date: August 28, 2008Inventors: Bhret Graydon, William Kuang-Hue Shu
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Publication number: 20080202799Abstract: A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is approximately the same as the diameter of the cylindrical component. The hole is similar to a via in a printed circuit board, except that the hole is not plated through (such would cause an electrical short). Electrically conductive lines are provided to the openings of the hole on the upper and the lower surfaces of the PCB. The area of the exposed end of the cylindrical component and the termination of the conducting line is less than the area of a surface mounted component equivalent to the cylindrical component.Type: ApplicationFiled: July 25, 2007Publication date: August 28, 2008Inventors: Bhret Graydon, William Kuang-Hue Shu
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Publication number: 20060130971Abstract: A method and apparatus for processing a substrate is provided. In one aspect, the chamber comprises a chamber body and a support assembly at least partially disposed within the chamber body adapted to support a substrate thereon. The chamber further comprises a lid assembly disposed on an upper surface of the chamber body. The lid assembly includes a top plate and a gas delivery assembly which define a plasma cavity therebetween, wherein the gas delivery assembly is adapted to heat the substrate. A remote plasma source having a U-shaped plasma region is connected to the gas delivery assembly.Type: ApplicationFiled: May 24, 2005Publication date: June 22, 2006Inventors: Yu Chang, Gwo-Chuan Tzu, Salvador Umotoy, Chien-Teh Kao, William Kuang, Xiaoxiong Yuan, Mei Chang
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Patent number: 6503820Abstract: The die pad crack absorption integrated circuit chip fabrication system and method of the present invention minimizes the spread of cracks between layers of an integrated circuit chip. During an integrated circuit chip fabrication process relatively elastic material is deposited in modular elastic filler blocks located between intermetal oxide (IMO) layers of an integrated circuit chip. The modular elastic filler blocks comprise material with a lesser elastic modulous than the surrounding IMO material. These elasticity characteristics and modular configuration of the modular elastic filler blocks results in the modular elastic filler blocks being more flexible than adjacent materials and having a greater capacity to dissipate stress energy that propels cracking forces through layers of an integrated chip. By absorbing the stress energy, the modular elastic filler blocks reduce the spread of crack through the layers of an integrated chip.Type: GrantFiled: October 4, 1999Date of Patent: January 7, 2003Assignee: Koninklijke Philips Electronics N.V.Inventor: William Kuang-Hua Shu
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Patent number: 6020647Abstract: Disclosed is a semiconductor chip and method for making a semiconductor chip having strategically placed composite metallization. The semiconductor chip includes a topmost metallization layer that defines a plurality of patterned features including a plurality of input/output metallization pads for receiving an associated plurality of gold bonding wires. An inter-metal oxide layer that is defined under the topmost metallization layer. The semiconductor chip further includes an underlying metallization layer that is defined under the inter-metal oxide layer in order to electrically isolate the topmost metallization layer from the underlying metallization layer. The underlying metallization has a plurality of patterned features, and portions of the plurality of patterned features lie at least partially in locations that are underlying the plurality of input/output metallization pads.Type: GrantFiled: December 18, 1998Date of Patent: February 1, 2000Assignee: VLSI Technology, Inc.Inventors: Stephen L. Skala, Subhas Bothra, Dipu Pramanik, William Kuang-Hua Shu