Patents by Inventor William L. Meyers

William L. Meyers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cleaved semiconductor wafer camera system
    Patent number: 11921054
    Abstract: A semiconductor wafer imaging system for imaging a semiconductor wafer includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: March 5, 2024
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, Vandan Tanna, William L. Luter
  • Impact energy dissipation vehicle
    Patent number: 5366034
    Abstract: A vehicle has a passenger compartment suspended between two wheels mounted at the ends of a single axle that is perpendicular to the direction of travel. The passenger compartment is mounted beneath the axle so as to allow the passenger compartment to repeatedly rotate in an unconstrained manner about the axle upon impact of the vehicle with another object so as to convert linear momentum of the vehicle into self-extinguishing angular momentum in order to dissipate energy and reduce injury to passengers in the passenger compartment.
    Type: Grant
    Filed: March 8, 1993
    Date of Patent: November 22, 1994
    Inventor: William L. Meyers