Abstract: A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

Abstract: A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

Abstract: A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

Abstract: A round cell battery comprising a stack of substantially cylindrically-shaped electrically conductive grid plates and two or more bus bars. One or more of the bus bars is electrically connected to outer rims of a set of alternating ones of the grid plates in the stack and to a positive voltage post of the battery. A different one or more of the bus bars is electrically connected to outer rims of a different set of alternate ones of the grid plates in the stack and to a negative voltage post of the battery.

Abstract: An apparatus for effecting inductive coupling among a plurality of electrical elements includes: (a) an electrically non-conductive core member oriented about an axis; (b) at least one first electrical element of the plurality of electrical elements substantially nestingly surrounding the core member oriented about the axis; each respective first electrical element being in spaced relation vis-à-vis other first electrical elements in an installed orientation; and (c) at least one second electrical element of the plurality of electrical elements disposed in surrounding relation with respect to the core member about the axis sufficiently proximal with at least one selected said first electrical element in the installed orientation to establish the inductive coupling.

Abstract: A system for fixing a substrate with a heat transferring device in an assembled orientation; the system comprising: a substantially rod-shaped positioning member having a length generally symmetrically oriented about an axis and a generally constant lateral expanse substantially perpendicular with said axis substantially along said length; said positioning member interferingly fitting within at least one of a first aperture in said substrate and a second aperture in said heat transferring device to maintain a predetermined separation between said substrate and said heat transferring device in said assembled orientation.

Abstract: An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation.

Abstract: An apparatus for connecting a plurality of electrical circuits borne upon a plurality of substrates is disclosed. A first substrate of the plurality of substrates has a first aperture having a first diametral displacement and a first inner wall. A portion of the first inner wall is electrically connected with a first circuit borne upon the first substrate. The apparatus comprises a sheet of electrically conductive material arranged to a displacement from an axis in a substantially helical orientation about the axis. The material has a spring characteristic when the helical orientation establishes the displacement at a spring displacement. The spring characteristic urges the conductive material to a greater displacement from the axis than the spring displacement and permits insertion of the apparatus in the first aperture. The spring characteristic and the first diametral dimension cooperate to seat the apparatus in the first aperture to establish electrical connection with the first circuit.

Abstract: A surface mount core assembly comprises a header with breakaway support rails. The breakaway support rails are used in the manufacturing process to maximize the core window of the assembly, and may be removed to minimize the footprint of the assembly. In the present embodiment, the assembly comprises, for example, a transformer wherein prefabricated conductor rings are used to further maximize the fill of the core window with conductor material.

Abstract: A cooling system for a circuit board employs a heat-conducing channel within the board. The channel is thermally coupled to an electrical device mounted on the board, and leads to an edge of the board. The edge of the board is coupled to a heat-dissipating can. The use of channels leading to the edges of the board allows a single can to dissipate heat for a plurality of boards and a plurality of devices.

Abstract: Methods of manufacturing a magnetic device and a manufacturing tool employing the methods. One of the methods includes the steps of: (1) providing a planar winding assembly and (2) employing an automated pick and placement tool adhesively to secure a first core-portion of a magnetic core to a second core-portion thereof proximate the planar winding assembly, the magnetic core adapted to impart a desired magnetic property to the planar winding assembly, the first and second core-portions being secured to said planar winding assembly without substantial compressive forces.

Abstract: A package for an electronic device, the electronic device including a body having a cavity therein, the body subject to stress from imposition of forces. The package includes a conforming compressible material disposed within at least a portion of the cavity in the body and substantially conforming to an interior configuration of the cavity, reducing imposition of the forces within the cavity and thereby reducing the stress on the body.

Abstract: Methods of manufacturing a magnetic device and a manufacturing tool employing the methods. One of the methods includes the steps of: (1) applying an adhesive between opposing end faces of first and second core-portions of a magnetic core of the magnetic device, (2) placing the first and second core-portions proximate a permanent magnet during a cure-time of the adhesive, the permanent magnet causing the first and second core-portions to be magnetically attracted to one another to fix the first core-portion relative to the second core-portion and (3) separating the permanent magnet from the first and second core-portions following expiration of the cure-time, the adhesive thereafter fixing the first core-portion relative to the second core-portion.

Abstract: An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.