Patents by Inventor William M. Sherry

William M. Sherry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering of electronic components
    Patent number: 4763829
    Abstract: Disclosed is a technique for providing solder bumps to electronic components, such as silicon chips, chip carriers, and circuit boards, so as to achieve large stand-off heights. The component is covered with a mask, such as a photoresist, leaving exposed the solder pads on the component. Solder is applied to the surface along with ultrasonic energy so that the solder wets the exposed pads. The mask acts as a mold for the solder, thereby producing large solder bump heights.
    Type: Grant
    Filed: June 4, 1986
    Date of Patent: August 16, 1988
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventor: William M. Sherry