Patents by Inventor William McKinzie, III

William McKinzie, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radar module
    Patent number: 9553371
    Abstract: An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy EBG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: January 24, 2017
    Assignee: NXP USA, INC.
    Inventors: James MacDonald, William McKinzie, III, Walter Parmon, Lawrence Rubin
  • Integrated antenna package
    Patent number: 9386688
    Abstract: An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy ERG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: July 5, 2016
    Assignee: Freescale Semiconductor, Inc.
    Inventors: James MacDonald, William McKinzie, III, Walter Parmon, Lawrence Rubin
  • Integrated antenna package
    Publication number: 20120119969
    Abstract: An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy ERG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 17, 2012
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: James MacDonald, William McKinzie, III, Walter Parmon, Lawrence Rubin
  • Radar module
    Publication number: 20120119932
    Abstract: An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy EBG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 17, 2012
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: James MacDonald, William McKinzie, III, Walter Parmon, Lawrence Rubin